Invention Grant
- Patent Title: Semiconductor package for thermal dissipation
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Application No.: US18175189Application Date: 2023-02-27
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Publication No.: US11804475B2Publication Date: 2023-10-31
- Inventor: Chen-Hua Yu , Shin-Puu Jeng , Der-Chyang Yeh , Hsien-Wei Chen , Cheng-Chieh Hsieh , Ming-Yen Chiu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- The original application number of the division: US15243694 2016.08.22
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L25/065 ; H01L23/498 ; H01L21/56 ; H01L25/10 ; H01L23/367 ; H01L23/31 ; H01L21/48 ; H01L23/00 ; H01L23/538 ; H01L25/16
Abstract:
A first package is bonded to a first substrate with first external connections and second external connections. The second external connections are formed using materials that are different than the first external connections in order to provide a thermal pathway from the first package. In a particular embodiment the first external connections are solder balls and the second external connections are copper blocks.
Public/Granted literature
- US20230207531A1 Semiconductor Package for Thermal Dissipation Public/Granted day:2023-06-29
Information query
IPC分类:
