Invention Grant
- Patent Title: Magnetic sensor
-
Application No.: US17701968Application Date: 2022-03-23
-
Publication No.: US11821963B2Publication Date: 2023-11-21
- Inventor: Daizo Endo , Akira Sakawaki
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Tokyo
- Assignee: Resonac Corporation
- Current Assignee: Resonac Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP 21053644 2021.03.26
- Main IPC: G01R33/06
- IPC: G01R33/06

Abstract:
A magnetic sensor 1 includes: a non-magnetic substrate 10; and a sensitive element 30 disposed on the substrate 10. The sensitive element 30 has a longitudinal direction and a transverse direction and has a uniaxial magnetic anisotropy in a direction intersecting the longitudinal direction. The sensitive element 30 is configured to sense a magnetic field by a magnetic impedance effect. The sensitive element 30 includes a soft magnetic material layer 101 made of an amorphous alloy based on Co and having a saturation magnetization of greater than or equal to 300 emu/cc and less than or equal to 650 emu/cc.
Public/Granted literature
- US20220308128A1 MAGNETIC SENSOR Public/Granted day:2022-09-29
Information query