Invention Grant
- Patent Title: Nozzle apparatus, apparatus and method for treating substrate
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Application No.: US16918341Application Date: 2020-07-01
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Publication No.: US11845090B2Publication Date: 2023-12-19
- Inventor: Chang Suk Oh , Woo Sin Jung , UnKyu Kang
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Cheonan-si
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Chungcheongnam-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20190079238 2019.07.02
- Main IPC: B05B1/16
- IPC: B05B1/16 ; B05B7/06 ; B05B12/00 ; B05B12/04 ; B05B14/00 ; B05B15/555 ; B05B16/20 ; B08B3/02 ; G03F7/16 ; G03F7/30 ; H01L21/02 ; H01L21/67 ; H01L21/687

Abstract:
An apparatus for performing liquid treatment for a substrate is provided. The apparatus for performing the liquid treatment for the substrate may include a housing having a treatment space, a substrate support unit to support and rotate the substrate in the treatment space, a liquid feeding unit including a nozzle device including a central exhaust port and multiple first outer exhaust ports, which are provided in a shape of a ring to form a concentric circle with the central exhaust port to feed mutually different treating liquids onto the substrate through respective exhaust ports, and a controller to control the liquid feeding unit.
Public/Granted literature
- US20210001357A1 NOZZLE APPARATUS, APPARATUS AND METHOD FOR TREATING SUBSTRATE Public/Granted day:2021-01-07
Information query
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