Invention Grant
- Patent Title: Multi-plate electrostatic chucks with ceramic baseplates
-
Application No.: US15903682Application Date: 2018-02-23
-
Publication No.: US11848177B2Publication Date: 2023-12-19
- Inventor: Feng Wang , Keith Gaff , Christopher Kimball
- Applicant: LAM RESEARCH CORPORATION
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67 ; H01J37/32 ; H01J37/244 ; H01L21/687
Abstract:
An electrostatic chuck for a substrate processing system is provided. The electrostatic chuck includes: a top plate configured to electrostatically clamp to a substrate and formed of ceramic; an intermediate layer disposed below the top plate; and a baseplate disposed below the intermediate layer and formed of ceramic. The intermediate layer bonds the top plate to the baseplate.
Public/Granted literature
- US20190267218A1 MULTI-PLATE ELECTROSTATIC CHUCKS WITH CERAMIC BASEPLATES Public/Granted day:2019-08-29
Information query
IPC分类:
