发明授权
- 专利标题： Substrate processing method, recording medium and substrate processing apparatus
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申请号： US17009834申请日： 2020-09-02
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公开(公告)号： US11848189B2公开(公告)日： 2023-12-19
- 发明人: Takahiro Shiozawa , Hiroki Tadatomo , Akiko Kai , Hiroshi Ichinomiya
- 申请人： Tokyo Electron Limited
- 申请人地址： JP Tokyo
- 专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人地址： JP Tokyo
- 代理机构： Pearne & Gordon LLP
- 优先权： JP 19160559 2019.09.03
- 主分类号： H01L21/06
- IPC分类号： H01L21/06 ; H01L21/027 ; H01L21/687 ; H01L21/67
摘要：
A substrate processing method includes supplying a developing liquid configured to form a resist pattern onto a surface of a substrate on which a resist film is formed; performing multiple cycles of a cleaning processing of supplying a modifying liquid containing a modifying agent having a hydrophilic group onto the surface of the substrate on which the resist pattern is formed and supplying a rinse liquid configured to remove the modifying liquid onto the surface of the substrate; and drying the surface of the substrate after performing the multiple cycles of the cleaning processing.
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