Invention Grant
- Patent Title: Polishing compositions and methods of use thereof
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Application No.: US17880758Application Date: 2022-08-04
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Publication No.: US11851585B2Publication Date: 2023-12-26
- Inventor: Ting-Kai Huang , Tawei Lin , Bin Hu , Liqing Wen , Yannan Liang
- Applicant: Fujifilm Electronic Materials U.S.A., Inc.
- Applicant Address: US RI N. Kingstown
- Assignee: Fujifilm Electronic Materials U.S.A., Inc.
- Current Assignee: Fujifilm Electronic Materials U.S.A., Inc.
- Current Assignee Address: US RI N. Kingstown
- Agency: Fish & Richardson P.C.
- Main IPC: C09G1/02
- IPC: C09G1/02 ; H01L21/321 ; C09K15/30
Abstract:
A polishing composition includes an abrasive; a pH adjuster; a barrier film removal rate enhancer; a low-k removal rate inhibitor; an azole-containing corrosion inhibitor; and a hard mask removal rate enhancer. A method of polishing a substrate includes the steps of: applying the polishing composition described herein to a surface of a substrate, wherein the surface comprises ruthenium or a hard mask material; and bringing a pad into contact with the surface of the substrate and moving the pad in relation to the substrate.
Public/Granted literature
- US20230203343A1 POLISHING COMPOSITIONS AND METHODS OF USE THEREOF Public/Granted day:2023-06-29
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