- 专利标题: Semiconductor device
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申请号: US16228803申请日: 2018-12-21
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公开(公告)号: US11855077B2公开(公告)日: 2023-12-26
- 发明人: Shigeki Sato , Seiji Momota , Tadashi Miyasaka
- 申请人: FUJI ELECTRIC CO., LTD.
- 申请人地址: JP Kanagawa
- 专利权人: FUJI ELECTRIC CO., LTD.
- 当前专利权人: FUJI ELECTRIC CO., LTD.
- 当前专利权人地址: JP Kanagawa
- 优先权: JP 18034260 2018.02.28
- 主分类号: H01L27/07
- IPC分类号: H01L27/07 ; H01L29/10 ; H01L29/423 ; H01L29/417 ; H01L29/08 ; H01L29/861 ; H01L29/06 ; H01L29/32 ; H01L29/40 ; H01L29/739
摘要:
A semiconductor device is preferably excellent in characteristics such as a loss characteristic. Provided is a semiconductor device including a semiconductor substrate, including an upper-surface electrode provided on an upper surface of the semiconductor substrate; an lower-surface electrode provided on a lower surface of the semiconductor substrate; a transistor portion provided in the semiconductor substrate and connected to the upper-surface electrode and the lower-surface electrode; a first diode portion provided in the semiconductor substrate and connected to the upper-surface electrode and the lower-surface electrode; and a second diode portion provided in the semiconductor substrate and connected to the upper-surface electrode and the lower-surface electrode, wherein the first diode portion and the second diode portion have different resistivities in a depth direction of the semiconductor substrate.
公开/授权文献
- US20190267370A1 SEMICONDUCTOR DEVICE 公开/授权日:2019-08-29
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