Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US17809573Application Date: 2022-06-29
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Publication No.: US11856869B2Publication Date: 2023-12-26
- Inventor: Yu-Feng Yin , Tai-Yen Peng , An-Shen Chang , Han-Ting Tsai , Qiang Fu , Chung-Te Lin
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT LAW
- Agent Anthony King
- Main IPC: H10N50/80
- IPC: H10N50/80 ; H01L21/768 ; H01L23/522 ; H10N50/01

Abstract:
The present disclosure provides a semiconductor structure, including a first metal line over a first region of the substrate, a first magnetic tunnel junction (MTJ) and a second MTJ over the first region of the substrate, and a top electrode extending over the first MTJ and the second MTJ, wherein the top electrode includes a protruding portion at a bottom surface of the top electrode.
Public/Granted literature
- US20220328755A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-10-13
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