Invention Grant
- Patent Title: Substrate liquid processing apparatus, substrate liquid processing method and recording medium
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Application No.: US16985424Application Date: 2020-08-05
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Publication No.: US11862486B2Publication Date: 2024-01-02
- Inventor: Kazuki Kosai , Yoshihiro Kai , Gentaro Goshi , Hiroshi Komiya , Seiya Fujimoto , Takahisa Otsuka
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP 15228833 2015.11.24
- The original application number of the division: US15777941
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B08B3/02 ; H01L21/3213 ; H01L21/306 ; B08B3/04 ; B08B3/08 ; H01L21/02 ; H01L21/687
Abstract:
A substrate processing apparatus includes a substrate holding unit 31 configured to hold a substrate W; an outer nozzle 45 configured to discharge a processing liquid toward a surface of the substrate from a position at an outside of an outer edge of the substrate held by the substrate holding unit such that at least a central portion of the surface of the substrate is covered with a liquid film of the discharged processing liquid; and an actuator 46 (90) configured to change a height position or a discharge angle of the outer nozzle.
Information query
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