公开(公告)号：US20180337067A1

公开(公告)日：2018-11-22

申请号：US15777941

申请日：2016-11-17

Applicant: Tokyo Electron Limited

Inventor： Kazuki Kosai ,  Yoshihiro Kai ,  Gentaro Goshi ,  Hiroshi Komiya ,  Seiya Fujimoto ,  Takahisa Otsuka

IPC: H01L21/67 ,  H01L21/306 ,  H01L21/687 ,  H01L21/02 ,  B08B3/08 ,  B08B3/04

Abstract: A substrate processing apparatus includes a substrate holding unit 31 configured to hold a substrate W; an outer nozzle 45 configured to discharge a processing liquid toward a surface of the substrate from a position at an outside of an outer edge of the substrate held by the substrate holding unit such that at least a central portion of the surface of the substrate is covered with a liquid film of the discharged processing liquid; and an actuator 46 (90) configured to change a height position or a discharge angle of the outer nozzle.

公开(公告)号：US11798819B2

公开(公告)日：2023-10-24

申请号：US17354128

申请日：2021-06-22

Applicant: Tokyo Electron Limited

Inventor： Kazuki Kosai ,  Yusuke Takamatsu ,  Taisei Inoue

IPC: H01L21/67 ,  H01L21/02 ,  B08B3/14 ,  B08B13/00 ,  B08B3/08

CPC classification number: H01L21/67051 ,  B08B3/08 ,  B08B3/14 ,  B08B13/00 ,  H01L21/02057 ,  B08B2203/007

Abstract: A liquid processing apparatus includes a storage tank, a circulation line, a supply line, a return line and at least one filter. The storage tank stores a processing liquid therein. Through the circulation line, the processing liquid sent from the storage tank is returned back into the storage tank. The supply line connects the circulation line and a supply configured to supply the processing liquid onto a substrate. The return line is connected to the supply line, and the processing liquid is returned back into the storage tank from the supply line through the return line. The filter is provided in at least one of the supply line on an upstream side of a connection point between the return line and the supply line or the return line, and is configured to remove a foreign substance in the processing liquid.

公开(公告)号：US10276408B2

公开(公告)日：2019-04-30

申请号：US14850139

申请日：2015-09-10

Applicant: TOKYO ELECTRON LIMITED

Inventor： Michitaka Amiya ,  Takami Satoh ,  Kazuyoshi Eshima ,  Akihiro Nakamura ,  Koji Tanaka ,  Kazuki Kosai

IPC: H01L21/67 ,  B01D19/02 ,  B01F3/08 ,  B01F15/00 ,  B01F15/02 ,  B08B3/08 ,  G05D7/01 ,  G05D11/13

Abstract: A flow-rate regulator device for controlling a flow rate of a liquid includes a first flow-rate regulator component positioned on an upstream side of a liquid line, and a second flow-rate regulator component positioned on a downstream side of the liquid line and connected in series to the first flow-rate regulator component. The first flow-rate regulator component adjusts a degree of opening such that a flow rate of liquid flowing through the liquid line is set a specified number of times greater than a target flow rate when the second flow-rate regulator component has a full opening, and the second flow-rate regulator component adjusts a degree of opening such that the flow rate of the liquid flowing through the liquid line is to be at the target flow rate when the first flow-rate regulator component is adjusted to have the degree of opening.

公开(公告)号：US11569086B2

公开(公告)日：2023-01-31

申请号：US17070951

申请日：2020-10-15

Applicant: Tokyo Electron Limited

Inventor： Kazuki Kosai ,  Kazuyoshi Shinohara

IPC: H01L21/02 ,  C11D7/08 ,  H01L21/67 ,  B08B3/04

Abstract: A substrate processing apparatus includes a substrate processing part that supplies a processing liquid from a processing liquid supply part to a mounted substrate to execute liquid processing, a liquid drainage part that has a recovery channel connected to a storage part that stores the processing liquid and drains the processing liquid used for the liquid processing, and a control unit executes a processing recipe for the liquid processing and a cleaning recipe for cleaning the substrate processing part and the liquid drainage part. The control unit executes a cleaning operation for supplying a cleaning liquid from a cleaning liquid supply part to clean the substrate processing part and the liquid drainage part and subsequently executes a return operation for supplying the processing liquid from the processing liquid supply part to replace the cleaning liquid attached to the substrate processing part and the liquid drainage part with the processing liquid.

公开(公告)号：US09627192B2

公开(公告)日：2017-04-18

申请号：US14803421

申请日：2015-07-20

Applicant: Tokyo Electron Limited

Inventor： Naoyuki Okamura ,  Kazuki Kosai ,  Kazuhiro Teraoka ,  Fumihiro Kamimura

IPC: B08B3/00 ,  H01L21/02 ,  H01L21/67

CPC classification number: H01L21/02041 ,  H01L21/02057 ,  H01L21/67051

Abstract: Disclosed is a substrate processing apparatus (a substrate processing method, and a computer readable storage medium having a substrate processing program stored therein) of cleaning an etched substrate with a polymer removing liquid, in which any of isopropyl alcohol vapor, water vapor, deionized water and isopropyl alcohol, ammonia water, and ammonia water and isopropyl alcohol is supplied to the substrate before the substrate is cleaned with the polymer removing liquid.

公开(公告)号：US20160027635A1

公开(公告)日：2016-01-28

申请号：US14803421

申请日：2015-07-20

Applicant: Tokyo Electron Limited

Inventor： Naoyuki Okamura ,  Kazuki Kosai ,  Kazuhiro Teraoka ,  Fumihiro Kamimura

IPC: H01L21/02 ,  H01L21/67

CPC classification number: H01L21/02041 ,  H01L21/02057 ,  H01L21/67051

Abstract: Disclosed is a substrate processing apparatus (a substrate processing method, and a computer readable storage medium having a substrate processing program stored therein) of cleaning an etched substrate with a polymer removing liquid, in which any of isopropyl alcohol vapor, water vapor, deionized water and isopropyl alcohol, ammonia water, and ammonia water and isopropyl alcohol is supplied to the substrate before the substrate is cleaned with the polymer removing liquid.

Abstract translation: 公开了一种用聚合物去除液清洗蚀刻的基板的基板处理装置（基板处理方法和其中存储有基板处理程序的计算机可读存储介质），其中异丙醇蒸气，水蒸气，去离子水 在用聚合物除去液体清洗基材之前，向基材供给异丙醇，氨水，氨水和异丙醇。

公开(公告)号：US12027394B2

公开(公告)日：2024-07-02

申请号：US18297042

申请日：2023-04-07

Applicant: Tokyo Electron Limited

Inventor： Hiroki Sakurai ,  Kazuki Kosai ,  Kazuyoshi Shinohara

IPC: B08B3/02 ,  B08B7/04 ,  B08B13/00 ,  H01L21/67

CPC classification number: H01L21/67253 ,  B08B3/022 ,  B08B13/00 ,  H01L21/67023

Abstract: A method includes: supplying a processing liquid to a center position of a substrate surface; shifting a supply position of the processing liquid from the center position to a first eccentric position; holding the supply position of the processing liquid at the first eccentric position and supplying a substitute liquid to a second eccentric position; shifting the supply position of the processing liquid in a direction away from the center position, and shifting a supply position of the substitute liquid to the center position; and supplying the processing liquid to the first eccentric position at a first flow rate, and reducing the flow rate of the processing liquid to a second flow rate after the supply position of the processing liquid starts to be shifted from the first eccentric position in the direction and until the supply position of the substitute liquid reaches the center position.

公开(公告)号：US20210398828A1

公开(公告)日：2021-12-23

申请号：US17354128

申请日：2021-06-22

Applicant: Tokyo Electron Limited

Inventor： Kazuki Kosai ,  Yusuke Takamatsu ,  Taisei Inoue

IPC: H01L21/67 ,  H01L21/02 ,  B08B3/08 ,  B08B3/14 ,  B08B13/00

Abstract: A liquid processing apparatus includes a storage tank, a circulation line, a supply line, a return line and at least one filter. The storage tank stores a processing liquid therein. Through the circulation line, the processing liquid sent from the storage tank is returned back into the storage tank. The supply line connects the circulation line and a supply configured to supply the processing liquid onto a substrate. The return line is connected to the supply line, and the processing liquid is returned back into the storage tank from the supply line through the return line. The filter is provided in at least one of the supply line on an upstream side of a connection point between the return line and the supply line or the return line, and is configured to remove a foreign substance in the processing liquid.

公开(公告)号：US10770316B2

公开(公告)日：2020-09-08

申请号：US15777941

申请日：2016-11-17

Applicant: Tokyo Electron Limited

Inventor： Kazuki Kosai ,  Yoshihiro Kai ,  Gentaro Goshi ,  Hiroshi Komiya ,  Seiya Fujimoto ,  Takahisa Otsuka

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/3213 ,  H01L21/306 ,  H01L21/02 ,  B08B3/08 ,  B08B3/04 ,  B08B3/02

Abstract: A substrate processing apparatus includes a substrate holding unit 31 configured to hold a substrate W; an outer nozzle 45 configured to discharge a processing liquid toward a surface of the substrate from a position at an outside of an outer edge of the substrate held by the substrate holding unit such that at least a central portion of the surface of the substrate is covered with a liquid film of the discharged processing liquid; and an actuator 46 (90) configured to change a height position or a discharge angle of the outer nozzle.

公开(公告)号：US12300518B2

公开(公告)日：2025-05-13

申请号：US17808160

申请日：2022-06-22

Applicant: Tokyo Electron Limited

Inventor： Kazuki Kosai ,  Hideaki Udou ,  Seiya Fujimoto ,  Yudai Takanaga ,  Takahito Nakashoya ,  Shogo Fukui ,  Atsushi Anamoto ,  So Osada

IPC: H01L21/67 ,  B08B13/00

Abstract: An apparatus includes: a tank storing a processing liquid; a circulation line; a branch line; a processing part for supplying the processing liquid to a substrate at the branch line; a discharge part for reducing a storage amount of the processing liquid; a supply part for supplying a new processing liquid to the tank; and a controller including: a first determination part for determining whether the storage amount is less than a lower limit value; a first replenishment controller for replenishing the processing liquid to the tank when the storage amount is less than the lower limit value; a calculation part for calculating a replenishment amount of the processing liquid; and a second replenishment controller for reducing the storage amount and replenishing the processing liquid to the tank when a calculation value of the replenishment amount is less than a set value.