公开(公告)号：US09764345B2

公开(公告)日：2017-09-19

申请号：US14291494

申请日：2014-05-30

Applicant: Tokyo Electron Limited

Inventor： Yoshihiro Kai ,  Yoshinori Ikeda ,  Kazuyoshi Shinohara ,  Tetsuya Oda ,  Satoru Tanaka ,  Yuki Yoshida ,  Meitoku Aibara

IPC: H01L21/67 ,  C03C23/00 ,  B05B15/02

CPC classification number: B05B15/555 ,  C03C23/0075 ,  H01L21/67051 ,  H01L21/6715

Abstract: A substrate processing apparatus according to the present disclosure includes first and second nozzles that eject a processing liquid to a substrate; a moving mechanism that moves the first and second nozzles; and a nozzle cleaning device that cleans at least the second nozzle. The nozzle cleaning device includes a cleaning bath and an overflow bath. The cleaning bath includes a liquid storage portion that stores a cleaning liquid for cleaning the second nozzle, and an overflow portion that discharges the cleaning liquid exceeding a predetermined level from the liquid storage portion. The overflow bath is disposed adjacent to the cleaning bath and receives the cleaning liquid discharged from the overflow portion and discharge the received cleaning liquid to the outside.

公开(公告)号：US11862486B2

公开(公告)日：2024-01-02

申请号：US16985424

申请日：2020-08-05

Applicant: Tokyo Electron Limited

Inventor： Kazuki Kosai ,  Yoshihiro Kai ,  Gentaro Goshi ,  Hiroshi Komiya ,  Seiya Fujimoto ,  Takahisa Otsuka

IPC: H01L21/67 ,  B08B3/02 ,  H01L21/3213 ,  H01L21/306 ,  B08B3/04 ,  B08B3/08 ,  H01L21/02 ,  H01L21/687

CPC classification number: H01L21/6708 ,  B08B3/024 ,  B08B3/041 ,  B08B3/08 ,  H01L21/02057 ,  H01L21/30604 ,  H01L21/30608 ,  H01L21/32134 ,  H01L21/6715 ,  H01L21/67051 ,  H01L21/67253 ,  H01L21/68764

Abstract: A substrate processing apparatus includes a substrate holding unit 31 configured to hold a substrate W; an outer nozzle 45 configured to discharge a processing liquid toward a surface of the substrate from a position at an outside of an outer edge of the substrate held by the substrate holding unit such that at least a central portion of the surface of the substrate is covered with a liquid film of the discharged processing liquid; and an actuator 46 (90) configured to change a height position or a discharge angle of the outer nozzle.

公开(公告)号：US11574827B2

公开(公告)日：2023-02-07

申请号：US16641713

申请日：2018-08-17

Applicant: Tokyo Electron Limited

Inventor： Tadashi Iino ,  Yoshihiro Kai ,  Yoichi Tokunaga ,  Nobuhiro Ogata ,  Jiro Higashijima

IPC: H01L21/67 ,  H01L21/304 ,  H01L21/306 ,  H01L21/687

Abstract: A substrate processing apparatus includes: a processing unit including a holder that holds a substrate and rotates the substrate, a nozzle that ejects a processing liquid, and a conductive piping unit that supplies the processing liquid to the nozzle; a controller that causes the processing unit to execute a liquid processing in which the substrate is processed by supplying the processing liquid from the nozzle to the substrate that is held and rotated by the holder, and a measuring unit that measures a flowing current generated by the processing liquid flowing through the piping unit. The controller monitors the liquid processing based on a measurement result by the measuring unit.

公开(公告)号：US10700166B2

公开(公告)日：2020-06-30

申请号：US13904315

申请日：2013-05-29

Applicant: Tokyo Electron Limited

Inventor： Yoshihiro Kai ,  Shinya Ishikawa ,  Yuji Kamikawa ,  Shuichi Nagamine ,  Naoki Shindo

IPC: B08B9/032 ,  H01L29/16 ,  B05B15/55 ,  B05B15/555 ,  B08B3/10 ,  H01L21/67 ,  H01L29/78 ,  B05B1/36

Abstract: A nozzle cleaning device is capable of uniformly cleaning a nozzle from a front end of the nozzle to an upper part thereof. The nozzle cleaning device includes a storage tank, a liquid discharging portion and an overflow discharging portion. The storage tank has a cylindrical inner peripheral surface and is configured to store therein a cleaning liquid that cleans a nozzle used in a substrate process. The liquid discharging portion is configured to discharge the cleaning liquid into the storage tank toward a position eccentric with respect to a central axis of the cylindrical inner peripheral surface to store the cleaning liquid within the storage tank and configured to form a vortex flow of the cleaning liquid revolving within the storage tank. The overflow discharging portion is configured to discharge the cleaning liquid that overflows the storage tank.

公开(公告)号：US09842751B2

公开(公告)日：2017-12-12

申请号：US14922441

申请日：2015-10-26

Applicant: Tokyo Electron Limited

Inventor： Shouta Umezaki ,  Yoshihiro Kai ,  Kazuki Kosai ,  Mitsuo Tanaka

IPC: B05B1/28 ,  B05C11/02 ,  H01L21/67

CPC classification number: H01L21/6708 ,  B05B1/28 ,  B05C11/02 ,  H01L21/67051

Abstract: Disclosed is a substrate liquid processing apparatus. The apparatus includes: a substrate holding unit configured to hold a substrate horizontally; a nozzle configured to eject a processing liquid in a transversal direction toward a liquid arrival target position set on the substrate held by the substrate holding unit from an ejection port which is located at an injection position spaced away from the liquid arrival target position by a predetermined distance horizontally; and a liquid receiving unit provided below the nozzle to receive the processing liquid dropping from the ejection port of the nozzle.

公开(公告)号：US09387520B2

公开(公告)日：2016-07-12

申请号：US13941770

申请日：2013-07-15

Applicant: Tokyo Electron Limited

Inventor： Nobuhiro Ogata ,  Terufumi Wakiyama ,  Yoshihiro Kai ,  Ryouga Kamo ,  Yoshinori Ikeda

IPC: H01L21/67 ,  B08B3/04

CPC classification number: B08B3/04 ,  H01L21/67051

Abstract: Disclosed are a liquid processing apparatus and a cleaning method which may perform cleaning on a portion which is not in the vicinity of a drain section in an exhaust route. The liquid processing apparatus includes an exhaust section provided in vicinity of the drain section, which is configured to exhaust a surrounding atmosphere of the substrate held by the substrate holding unit; an exhaust route forming member configured to form an exhaust route reaching the exhaust section; and a first cleaning unit configured to supply a cleaning liquid to the exhaust route forming member at the exhaust route side.

Abstract translation: 公开了一种液体处理设备和清洁方法，其可以对排气路径中不在排水区附近的部分进行清洁。 液体处理装置包括设置在排出部附近的排气部，该排气部构造为排出由基板保持单元保持的基板的周围的气氛; 排气路径形成部件，其构成为形成到达排气部的排气路径; 以及构造成在排气路径侧向排气路径形成部件供给清洗液的第一清洗部。

公开(公告)号：US20160114345A1

公开(公告)日：2016-04-28

申请号：US14922441

申请日：2015-10-26

Applicant: Tokyo Electron Limited

Inventor： Shouta Umezaki ,  Yoshihiro Kai ,  Kazuki Kosai ,  Mitsuo Tanaka

IPC: B05B13/02 ,  B05B1/00

CPC classification number: H01L21/6708 ,  B05B1/28 ,  B05C11/02 ,  H01L21/67051

Abstract: Disclosed is a substrate liquid processing apparatus. The apparatus includes: a substrate holding unit configured to hold a substrate horizontally; a nozzle configured to eject a processing liquid in a transversal direction toward a liquid arrival target position set on the substrate held by the substrate holding unit from an ejection port which is located at an injection position spaced away from the liquid arrival target position by a predetermined distance horizontally; and a liquid receiving unit provided below the nozzle to receive the processing liquid dropping from the ejection port of the nozzle.

Abstract translation: 公开了一种基板液体处理装置。 该装置包括：基板保持单元，被配置为水平地保持基板; 喷嘴，被配置为从设置在由所述基板保持单元保持的所述基板上的液体到达目标位置朝向从所述液体到达目标位置隔开预定的喷射口的喷出口喷射处理液， 水平距离 以及液体接收单元，设置在喷嘴下方，以接收从喷嘴的喷射口落下的处理液。

公开(公告)号：US20130319470A1

公开(公告)日：2013-12-05

申请号：US13904315

申请日：2013-05-29

Applicant: Tokyo Electron Limited

Inventor： Yoshihiro Kai ,  Shinya Ishikawa ,  Yuji Kamikawa ,  Shuichi Nagamine ,  Naoki Shindo

IPC: B08B9/032

CPC classification number: H01L29/1608 ,  B05B1/36 ,  B05B15/555 ,  B05B15/557 ,  B08B3/102 ,  B08B9/0321 ,  B08B9/0328 ,  H01L21/67051 ,  H01L29/7813

Abstract: A nozzle cleaning device is capable of uniformly cleaning a nozzle from a front end of the nozzle to an upper part thereof. The nozzle cleaning device includes a storage tank, a liquid discharging portion and an overflow discharging portion. The storage tank has a cylindrical inner peripheral surface and is configured to store therein a cleaning liquid that cleans a nozzle used in a substrate process. The liquid discharging portion is configured to discharge the cleaning liquid into the storage tank toward a position eccentric with respect to a central axis of the cylindrical inner peripheral surface to store the cleaning liquid within the storage tank and configured to form a vortex flow of the cleaning liquid revolving within the storage tank. The overflow discharging portion is configured to discharge the cleaning liquid that overflows the storage tank.

Abstract translation: 喷嘴清洁装置能够从喷嘴的前端到其上部均匀地清洁喷嘴。 喷嘴清洁装置包括储罐，液体排出部分和溢流排放部分。 储罐具有圆筒形的内周面，并且构造成在其中存储清洁基板工艺中使用的喷嘴的清洗液。 液体排出部分被配置成将清洁液体排出到相对于圆筒形内周面的中心轴线偏心的位置，以将清洗液储存在储罐内，并且构造成形成清洁的涡流 液体在储罐内旋转。 溢流排出部被配置为排出溢出储罐的清洗液。

公开(公告)号：US11742223B2

公开(公告)日：2023-08-29

申请号：US16737027

申请日：2020-01-08

Applicant: Tokyo Electron Limited

Inventor： Yuji Kimura ,  Yoshihiro Kai

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/677

CPC classification number: H01L21/67086 ,  H01L21/67057 ,  H01L21/67742 ,  H01L21/68771

Abstract: A substrate processing apparatus comprises a processing tub and a fluid supply. In the processing tub, a processing is performed on multiple substrates by immersing the multiple substrates in a processing liquid. The fluid supply is disposed under the multiple substrates within the processing tub and configured to discharge a fluid to generate a liquid flow of the processing liquid within the processing tub. Further, the fluid supply includes multiple discharge paths configured to discharge the fluid to different regions in an arrangement direction of the multiple substrates.

公开(公告)号：US10770316B2

公开(公告)日：2020-09-08

申请号：US15777941

申请日：2016-11-17

Applicant: Tokyo Electron Limited

Inventor： Kazuki Kosai ,  Yoshihiro Kai ,  Gentaro Goshi ,  Hiroshi Komiya ,  Seiya Fujimoto ,  Takahisa Otsuka

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/3213 ,  H01L21/306 ,  H01L21/02 ,  B08B3/08 ,  B08B3/04 ,  B08B3/02

Abstract: A substrate processing apparatus includes a substrate holding unit 31 configured to hold a substrate W; an outer nozzle 45 configured to discharge a processing liquid toward a surface of the substrate from a position at an outside of an outer edge of the substrate held by the substrate holding unit such that at least a central portion of the surface of the substrate is covered with a liquid film of the discharged processing liquid; and an actuator 46 (90) configured to change a height position or a discharge angle of the outer nozzle.