Invention Grant
- Patent Title: Encapsulated fluorescent adhesive layer having a quantum dot material
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Application No.: US16757390Application Date: 2020-03-24
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Publication No.: US11870014B2Publication Date: 2024-01-09
- Inventor: Hongquan Wei
- Applicant: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: PV IP PC
- Agent Wei Te Chung; Zhigang Ma
- Priority: CN 2010128800.7 2020.02.28
- International Application: PCT/CN2020/080844 2020.03.24
- International Announcement: WO2021/168954A 2021.09.02
- Date entered country: 2020-04-18
- Main IPC: H01L33/50
- IPC: H01L33/50 ; C09J11/04 ; C09J11/06 ; C09J133/08 ; C09J163/00 ; C09J183/04 ; H01L33/54
Abstract:
The present disclosure provides an encapsulated fluorescent adhesive layer, a method for manufacturing the same, and a quantum dot backlight. The quantum dot backlight includes a substrate, a light emitting chip, and the encapsulated fluorescent adhesive layer. The encapsulated fluorescent adhesive layer is used for heat transfer and heat dissipation.
Public/Granted literature
- US20220310885A1 ENCAPSULATED FLUORESCENT ADHESIVE LAYER, METHOD FOR MANUFACTURING THEREOF, AND QUANTUM DOT BACKLIGHT Public/Granted day:2022-09-29
Information query
IPC分类:
