Invention Grant
- Patent Title: Nanotip filament confinement
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Application No.: US17469203Application Date: 2021-09-08
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Publication No.: US11877524B2Publication Date: 2024-01-16
- Inventor: Juntao Li , Kangguo Cheng , Dexin Kong , Zheng Xu
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Samuel Waldbaum
- Main IPC: H10N70/00
- IPC: H10N70/00

Abstract:
Methods of forming a settable resistance device, settable resistance devices, and neuromorphic computing devices include isotropically etching a stack of layers, the stack of layers having an insulator layer in contact with a conductor layer, to selectively form divots in exposed sidewalls of the conductor layer. The stack of layers is isotropically etched to selectively form divots in exposed sidewalls of the insulator layer, thereby forming a tip at an interface between the insulator layer and the conductor layer. A dielectric layer is formed over the stack of layers to cover the tip. An electrode is formed over the dielectric layer, such that the dielectric layer is between the electrode and the tip.
Public/Granted literature
- US20230074224A1 NANOTIP FILAMENT CONFINEMENT Public/Granted day:2023-03-09
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