- 专利标题: Substrate processing apparatus and substrate processing method
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申请号: US16473077申请日: 2017-11-28
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公开(公告)号: US11881417B2公开(公告)日: 2024-01-23
- 发明人: Shuichi Yasuda , Kenji Kobayashi
- 申请人: SCREEN Holdings Co., Ltd.
- 申请人地址: JP Kyoto
- 专利权人: SCREEN Holdings Co., Ltd.
- 当前专利权人: SCREEN Holdings Co., Ltd.
- 当前专利权人地址: JP Kyoto
- 代理机构: OSTROLENK FABER LLP
- 优先权: JP 17006405 2017.01.18
- 国际申请: PCT/JP2017/042645 2017.11.28
- 国际公布: WO2018/135138A 2018.07.26
- 进入国家日期: 2019-06-24
- 主分类号: H01L21/67
- IPC分类号: H01L21/67 ; B01F23/40 ; B01F23/45 ; B01F23/454 ; B08B3/00 ; B01F35/83 ; B01F35/221
摘要:
First and second concentration measurements are provided in lines for first and second supply liquid lines. A dissolved concentration of gas in the second supply liquid is lower than that in the first supply liquid. In the first and second lines, first ends of branch lines are connected upstream of the concentration measurements. The second ends of the branch lines are connected to a mixing part. By mixing the first and second supply liquids, a processing liquid is generated. Respective flow rates in the branch lines are based on the first and second concentration measurements to set the dissolved concentration of the gas in the processing liquid. Thus, particles or the like can be removed from the processing liquid to be supplied to a substrate, and the dissolved concentration of the gas in the processing liquid can be set with high accuracy.
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