Invention Grant
- Patent Title: Carbon based polymer thermal interface materials with polymer chain to carbon based fill particle bonds
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Application No.: US16798118Application Date: 2020-02-21
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Publication No.: US11881440B2Publication Date: 2024-01-23
- Inventor: Marely E. Tejeda Ferrari , Taylor Gaines , Elah Bozorg-Grayeli , James C. Matayabas, Jr.
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L21/48 ; H01L23/367 ; H01L23/42 ; C08K3/04 ; C09K5/14
Abstract:
Microelectronic devices, assemblies, and systems include a microelectronic die and composite material to conduct heat from the microelectronic die such that the composite material includes polymer chains chemically bonded to fill particles having a hexagonal lattice of carbon atoms such as graphene sheet fill particles and/or carbon nanotube fill particles.
Public/Granted literature
- US20210265238A1 CARBON BASED POLYMER THERMAL INTERFACE MATERIALS WITH POLYMER CHAIN TO CARBON BASED FILL PARTICLE BONDS Public/Granted day:2021-08-26
Information query
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