公开(公告)号：US20210265238A1

公开(公告)日：2021-08-26

申请号：US16798118

申请日：2020-02-21

Applicant: INTEL CORPORATION

Inventor： Marely E. Tejeda Ferrari ,  Taylor Gaines ,  Elah Bozorg-Grayeli ,  James C. Matayabas, JR.

IPC: H01L23/373 ,  H01L23/367 ,  H01L23/42 ,  H01L21/48 ,  C09K5/14 ,  C08K3/04

Abstract: Microelectronic devices, assemblies, and systems include a microelectronic die and composite material to conduct heat from the microelectronic die such that the composite material includes polymer chains chemically bonded to fill particles having a hexagonal lattice of carbon atoms such as graphene sheet fill particles and/or carbon nanotube fill particles.

公开(公告)号：US20210375719A1

公开(公告)日：2021-12-02

申请号：US17399882

申请日：2021-08-11

Applicant: Intel Corporation

Inventor： Feras Eid ,  Shrenik Kothari ,  Chandra M. Jha ,  Johanna M. Swan ,  Michael J. Baker ,  Shawna M. Liff ,  Thomas L. Sounart ,  Betsegaw K. Gebrehiwot ,  Shankar Devasenathipathy ,  Taylor Gaines ,  Digvijay Ashokkumar Raorane

IPC: H01L23/433 ,  H01L23/29 ,  H01L21/56 ,  H01L25/00 ,  H01L25/18 ,  H01L23/42 ,  H01L23/367 ,  H01L23/04 ,  H01L25/065 ,  H01L25/16 ,  H01L23/16

Abstract: A semiconductor device that has a semiconductor die coupled to a substrate. A mold compound encapsulates the semiconductor die, and at least one thermal conductive material section extends from adjacent the semiconductor die through the mold compound. The at least one conductive material section thus conveys heat from the semiconductor die through the mold compound.

公开(公告)号：US11881440B2

公开(公告)日：2024-01-23

申请号：US16798118

申请日：2020-02-21

Applicant: INTEL CORPORATION

Inventor： Marely E. Tejeda Ferrari ,  Taylor Gaines ,  Elah Bozorg-Grayeli ,  James C. Matayabas, Jr.

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/367 ,  H01L23/42 ,  C08K3/04 ,  C09K5/14

CPC classification number: H01L23/3737 ,  C08K3/041 ,  C08K3/042 ,  C09K5/14 ,  H01L21/4871 ,  H01L23/367 ,  H01L23/42 ,  C08K2201/001 ,  C08K2201/011

Abstract: Microelectronic devices, assemblies, and systems include a microelectronic die and composite material to conduct heat from the microelectronic die such that the composite material includes polymer chains chemically bonded to fill particles having a hexagonal lattice of carbon atoms such as graphene sheet fill particles and/or carbon nanotube fill particles.

公开(公告)号：US20210202348A1

公开(公告)日：2021-07-01

申请号：US16727770

申请日：2019-12-26

Applicant: Intel Corporation

Inventor： Kyle Arrington ,  Frederick Atadana ,  Taylor Gaines ,  Minseok Ha

IPC: H01L23/373 ,  H01L23/367 ,  H01L21/48

Abstract: An integrated circuit (IC) assembly comprising an IC die and a frame material that has been dispensed over the assembly substrate to be further adjacent to a perimeter edge of the IC die. The frame material may be selected to have flow properties that minimize slump, for example so a profile of a transverse cross-section through the frame material may retain convex curvature. The frame material may be cured following dispense, and upon application of a thermal interface material (TIM), the frame material may and act as a barrier, impeding flow of the TIM. The frame material may be compressed by force applied through an external thermal solution, such as a heat sink, to ensure good contact to the TIM.

公开(公告)号：US11842944B2

公开(公告)日：2023-12-12

申请号：US16727770

申请日：2019-12-26

Applicant: Intel Corporation

Inventor： Kyle Arrington ,  Frederick Atadana ,  Taylor Gaines ,  Minseok Ha

IPC: H01L23/373 ,  H01L23/367 ,  H01L21/48

CPC classification number: H01L23/373 ,  H01L21/4882 ,  H01L23/3675

Abstract: An integrated circuit (IC) assembly comprising an IC die and a frame material that has been dispensed over the assembly substrate to be further adjacent to a perimeter edge of the IC die. The frame material may be selected to have flow properties that minimize slump, for example so a profile of a transverse cross-section through the frame material may retain convex curvature. The frame material may be cured following dispense, and upon application of a thermal interface material (TIM), the frame material may and act as a barrier, impeding flow of the TIM. The frame material may be compressed by force applied through an external thermal solution, such as a heat sink, to ensure good contact to the TIM.

公开(公告)号：US11676876B2

公开(公告)日：2023-06-13

申请号：US16557891

申请日：2019-08-30

Applicant: Intel Corporation

Inventor： Ziyin Lin ,  Elizabeth Nofen ,  Vipul Mehta ,  Taylor Gaines

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/367 ,  H01L23/373 ,  H01L21/67

CPC classification number: H01L23/3178 ,  H01L21/565 ,  H01L21/67288 ,  H01L23/367 ,  H01L23/373

Abstract: A device is disclosed. The device includes a first die, a plurality of chiplets above the first die, a first underfill material beneath the chiplets, and a gap fill material between the chiplets. The gap fill material is different from the first underfill material. An interface region is formed between the first underfill material and the gap fill material.

公开(公告)号：US20180235075A1

公开(公告)日：2018-08-16

申请号：US15434919

申请日：2017-02-16

Applicant: Intel Corporation

Inventor： Taylor Gaines ,  Anna M. Prakash ,  Ziv Belman ,  Baruch Schiffmann ,  Arnon Hirshberg ,  Ron Wittenberg ,  Vladimir Malamud

IPC: H05K1/02 ,  H05K3/22 ,  H05K1/18

CPC classification number: H01L23/552 ,  H05K1/0218 ,  H05K1/0243 ,  H05K2201/0317 ,  H05K2201/0715 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10159 ,  H05K2201/2018 ,  H05K2203/072 ,  H05K2203/0723

Abstract: Semiconductor packages may include different portions associated one or more electronic components of the semiconductor package where electromagnetic (for example, radio-frequency, RF) shielding at predetermined frequencies ranges may be needed. Accordingly, in an embodiment, compartmental shielding can be used in the areas between the electronic components on the semiconductor package to provide RF shielding to the electronic components on the semiconductor package or to other electronic components in proximity to the electronic components on the semiconductor package. Further, in another embodiment, conformal coating shielding can be used to provide RF shielding to provide RF shielding to the electronic components on the semiconductor package or to other electronic components in proximity to the electronic components on the semiconductor package.