公开(公告)号：US11881440B2

公开(公告)日：2024-01-23

申请号：US16798118

申请日：2020-02-21

Applicant: INTEL CORPORATION

Inventor： Marely E. Tejeda Ferrari ,  Taylor Gaines ,  Elah Bozorg-Grayeli ,  James C. Matayabas, Jr.

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/367 ,  H01L23/42 ,  C08K3/04 ,  C09K5/14

CPC classification number: H01L23/3737 ,  C08K3/041 ,  C08K3/042 ,  C09K5/14 ,  H01L21/4871 ,  H01L23/367 ,  H01L23/42 ,  C08K2201/001 ,  C08K2201/011

Abstract: Microelectronic devices, assemblies, and systems include a microelectronic die and composite material to conduct heat from the microelectronic die such that the composite material includes polymer chains chemically bonded to fill particles having a hexagonal lattice of carbon atoms such as graphene sheet fill particles and/or carbon nanotube fill particles.

公开(公告)号：US20210265238A1

公开(公告)日：2021-08-26

申请号：US16798118

申请日：2020-02-21

Applicant: INTEL CORPORATION

Inventor： Marely E. Tejeda Ferrari ,  Taylor Gaines ,  Elah Bozorg-Grayeli ,  James C. Matayabas, JR.

IPC: H01L23/373 ,  H01L23/367 ,  H01L23/42 ,  H01L21/48 ,  C09K5/14 ,  C08K3/04

Abstract: Microelectronic devices, assemblies, and systems include a microelectronic die and composite material to conduct heat from the microelectronic die such that the composite material includes polymer chains chemically bonded to fill particles having a hexagonal lattice of carbon atoms such as graphene sheet fill particles and/or carbon nanotube fill particles.