- 专利标题: Package core assembly and fabrication methods
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申请号: US17227867申请日: 2021-04-12
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公开(公告)号: US11881447B2公开(公告)日: 2024-01-23
- 发明人: Han-Wen Chen , Steven Verhaverbeke , Giback Park , Kyuil Cho , Kurtis Leschkies , Roman Gouk , Chintan Buch , Vincent Dicaprio , Bernhard Stonas , Jean Delmas
- 申请人: Applied Materials, Inc.
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Patterson + Sheridan, LLP
- 主分类号: H01L23/538
- IPC分类号: H01L23/538 ; H01L23/367 ; H01L23/498 ; H01L21/48 ; H01L23/14
摘要:
The present disclosure relates to semiconductor core assemblies and methods of forming the same. The semiconductor core assemblies described herein may be utilized to form semiconductor package assemblies, PCB assemblies, PCB spacer assemblies, chip carrier assemblies, intermediate carrier assemblies (e.g., for graphics cards), and the like. In one embodiment, a silicon substrate core is structured by direct laser patterning. One or more conductive interconnections are formed in the substrate core and one or more redistribution layers are formed on surfaces thereof. The silicon substrate core may thereafter be utilized as a core structure for a semiconductor package, PCB, PCB spacer, chip carrier, intermediate carrier, or the like.
公开/授权文献
- US20210249345A1 PACKAGE CORE ASSEMBLY AND FABRICATION METHODS 公开/授权日:2021-08-12
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