Invention Grant
- Patent Title: Package core assembly and fabrication methods
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Application No.: US17227867Application Date: 2021-04-12
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Publication No.: US11881447B2Publication Date: 2024-01-23
- Inventor: Han-Wen Chen , Steven Verhaverbeke , Giback Park , Kyuil Cho , Kurtis Leschkies , Roman Gouk , Chintan Buch , Vincent Dicaprio , Bernhard Stonas , Jean Delmas
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/367 ; H01L23/498 ; H01L21/48 ; H01L23/14

Abstract:
The present disclosure relates to semiconductor core assemblies and methods of forming the same. The semiconductor core assemblies described herein may be utilized to form semiconductor package assemblies, PCB assemblies, PCB spacer assemblies, chip carrier assemblies, intermediate carrier assemblies (e.g., for graphics cards), and the like. In one embodiment, a silicon substrate core is structured by direct laser patterning. One or more conductive interconnections are formed in the substrate core and one or more redistribution layers are formed on surfaces thereof. The silicon substrate core may thereafter be utilized as a core structure for a semiconductor package, PCB, PCB spacer, chip carrier, intermediate carrier, or the like.
Public/Granted literature
- US20210249345A1 PACKAGE CORE ASSEMBLY AND FABRICATION METHODS Public/Granted day:2021-08-12
Information query
IPC分类: