Invention Grant
- Patent Title: Photonic optoelectronic module packaging
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Application No.: US16993587Application Date: 2020-08-14
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Publication No.: US11886023B2Publication Date: 2024-01-30
- Inventor: Gilles P. Denoyer , Daniel Mahgerefteh , Vipul Bhatt , Shiyun Lin , Brian Kim
- Applicant: FINISAR CORPORATION
- Applicant Address: US CA Sunnyvale
- Assignee: II-VI DELAWARE, INC.
- Current Assignee: II-VI DELAWARE, INC.
- Current Assignee Address: US DE Wilmington
- Agency: Blank Rome LLP
- Main IPC: G02B6/42
- IPC: G02B6/42 ; H01L23/498 ; H01L23/00

Abstract:
In one example, an optoelectronic module may include a stack assembly including an electrical integrated circuit and an optical integrated circuit electrically and mechanically coupled to one another, an interposer electrically and mechanically coupled to the stack assembly, and an optical connector to optically couple the optical integrated circuit with an array of optical fibers.
Public/Granted literature
- US20210048587A1 PHOTONIC OPTOELECTRONIC MODULE PACKAGING Public/Granted day:2021-02-18
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