公开(公告)号：US11886023B2

公开(公告)日：2024-01-30

申请号：US16993587

申请日：2020-08-14

申请人： FINISAR CORPORATION

发明人： Gilles P. Denoyer ,  Daniel Mahgerefteh ,  Vipul Bhatt ,  Shiyun Lin ,  Brian Kim

IPC分类号： G02B6/42 ,  H01L23/498 ,  H01L23/00

CPC分类号： G02B6/423 ,  G02B6/4202 ,  G02B6/4249 ,  H01L23/49844 ,  H01L24/81

摘要： In one example, an optoelectronic module may include a stack assembly including an electrical integrated circuit and an optical integrated circuit electrically and mechanically coupled to one another, an interposer electrically and mechanically coupled to the stack assembly, and an optical connector to optically couple the optical integrated circuit with an array of optical fibers.

公开(公告)号：US20210048587A1

公开(公告)日：2021-02-18

申请号：US16993587

申请日：2020-08-14

申请人： FINISAR CORPORATION

发明人： Gilles P. Denoyer ,  Daniel Mahgerefteh ,  Vipul Bhatt ,  Shiyun Lin ,  Brian Kim

IPC分类号： G02B6/42 ,  H01L23/498 ,  H01L23/00

摘要： In one example, an optoelectronic module may include a stack assembly including an electrical integrated circuit and an optical integrated circuit electrically and mechanically coupled to one another, an interposer electrically and mechanically coupled to the stack assembly, and an optical connector to optically couple the optical integrated circuit with an array of optical fibers.