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    Adiabatic optical coupler for direct SOI to interposer coupling
    1.
    发明授权
    Adiabatic optical coupler for direct SOI to interposer coupling 有权

    公开(公告)号：US10962721B2

    公开(公告)日：2021-03-30

    申请号：US16547252

    申请日：2019-08-21

    Applicant: FINISAR CORPORATION

    Inventor： Shiyun Lin ,  Daniel Mahgerefteh

    IPC: G02B6/30 ,  G02B6/34 ,  G02B6/122

    Abstract: An adiabatic optical coupler can include: a top tapered region that includes a top taper having two top tapered sides that taper from a first end region to a top tip region, the top taper having a first length; and a bottom tapered region under the top tapered region, wherein the bottom tapered region includes a bottom taper having two bottom tapered sides that taper from the first end region to a bottom tip region, the bottom taper having a second length that is longer than the first length. Another adiabatic optical coupler can include: a tapered region that includes a taper having two tapered sides that taper from an end region to a tip region; and a sub-wavelength grating (SWG) optically coupled with the tip region. Another adiabatic optical coupler can include a combination of these two adiabatic optical couplers.

    VERTICAL JUNCTION BASED SILICON MODULATOR
    2.
    发明申请
    VERTICAL JUNCTION BASED SILICON MODULATOR 审中-公开

    公开(公告)号：US20200257180A1

    公开(公告)日：2020-08-13

    申请号：US16271467

    申请日：2019-02-08

    Applicant: Finisar Corporation

    Inventor： Daniel Mahgerefteh ,  Ying Luo ,  Shiyun Lin ,  Jin-Hyoung Lee

    IPC: G02F1/225

    Abstract: In one example embodiment, an optical circuit for optical modulation of light may include an input waveguide including a first thickness, an optical modulator including a second thickness, and a tapered transition that optically couples the optical modulator and the input waveguide. The second thickness may be smaller than the first thickness. The tapered transition may adiabatically transform the optical mode of the input waveguide to the optical modulator.

    FABRICATION-TOLERANT AND BROADBAND POLARIZATION SPLITTER AND ROTATOR
    3.
    发明申请
    FABRICATION-TOLERANT AND BROADBAND POLARIZATION SPLITTER AND ROTATOR 审中-公开

    公开(公告)号：US20190033520A1

    公开(公告)日：2019-01-31

    申请号：US16045218

    申请日：2018-07-25

    Applicant: Finisar Corporation

    Inventor： Shiyun Lin ,  Jin-Hyoung Lee

    IPC: G02B6/126 ,  G02B6/122 ,  G02B6/27

    Abstract: A PCR can include: a substrate; a primary through waveguide formed in the substrate having a custom tapered top region over a bottom region; a secondary cross waveguide formed in the substrate having a custom body shape; and a gap between the primary through waveguide and secondary cross waveguide. The custom tapered top region forces the TM mode to convert to a TE mode and cross into the secondary cross waveguide.

    SURFACE COUPLED LASER AND LASER OPTICAL INTERPOSER
    6.
    发明申请
    SURFACE COUPLED LASER AND LASER OPTICAL INTERPOSER 有权

    公开(公告)号：US20210109301A1

    公开(公告)日：2021-04-15

    申请号：US15929861

    申请日：2020-05-26

    Applicant: Finisar Corporation

    Inventor： Daniel Mahgerefteh ,  Jin-Hyoung Lee ,  Shiyun Lin

    IPC: G02B6/42 ,  G02B6/12 ,  G02B6/122 ,  G02B6/34 ,  H01S5/0225 ,  H01S5/02326

    Abstract: An example system includes a grating coupled laser, a laser optical interposer (LOI), an optical isolator, and a light redirector. The grating coupled laser includes a laser cavity and a transmit grating optically coupled to the laser cavity. The transmit grating is configured to diffract light emitted by the laser cavity out of the grating coupled laser. The LOI includes an LOI waveguide with an input end and an output end. The optical isolator is positioned between the surface coupled edge emitting laser and the LOI. The light redirector is positioned to redirect the light, after the light passes through the optical isolator, into the LOI waveguide of the LOI.

    LENS-LESS LASER MICRO-PACKAGE ASSEMBLY
    7.
    发明申请
    LENS-LESS LASER MICRO-PACKAGE ASSEMBLY 审中-公开

    公开(公告)号：US20200073065A1

    公开(公告)日：2020-03-05

    申请号：US16555701

    申请日：2019-08-29

    Applicant: Finisar Corporation

    Inventor： Bernd Huebner ,  Tsurugi Sudo ,  Shiyun Lin

    IPC: G02B6/42

    Abstract: An optoelectronic assembly may include a photonic integrated circuit (PIC) with a top surface and a laser with a top surface and a bottom surface. The optoelectronic assembly may also include a housing configured to cooperate with the PIC to one or both of house and support one or more components. The housing may include a PIC mount including a first surface to interface with the top surface of the PIC, and a laser mount including a second surface to interface with the top or bottom surface of the laser. The first surface and the second surface may be parallel to each other.

    Wafer level testing of optical components
    9.
    发明授权
    Wafer level testing of optical components 有权

    公开(公告)号：US11295994B2

    公开(公告)日：2022-04-05

    申请号：US16517404

    申请日：2019-07-19

    Applicant: FINISAR CORPORATION

    Inventor： Shiyun Lin ,  Daniel Mahgerefteh ,  Bryan Park ,  Jin-Hyoung Lee

    IPC: H01L21/66 ,  G02B6/42 ,  G01R31/28 ,  G02B6/13 ,  G01R31/311 ,  G02B1/11

    Abstract: A system may include a wafer that includes ICs and defines cavities. Each cavity may be formed in a BEOL layer of the wafer and proximate a different IC. The system may also include an interposer that includes a transparent layer configured to permit optical signals to pass through. The interposer may also include at least one waveguide located proximate the transparent layer. The at least one waveguide may be configured to adiabatically couple at least one optical signal out of the multiple ICs. Further, the interposer may include a redirecting element optically coupled to the at least one the waveguide. The redirecting element may be located proximate the transparent layer and may be configured to receive the at least one optical signal from the at least one waveguide. The redirecting element may also be configured to vertically redirect the at least one optical signal towards the transparent layer.

    HIGH POWER LASER ARRAY DEVICES AND METHODS
    10.
    发明申请
    HIGH POWER LASER ARRAY DEVICES AND METHODS 有权

    公开(公告)号：US20210028593A1

    公开(公告)日：2021-01-28

    申请号：US16906909

    申请日：2020-06-19

    Applicant: FINISAR CORPORATION

    Inventor： Shiyun Lin ,  Tsurugi Sudo

    IPC: H01S3/094 ,  H01S3/23 ,  H01S3/08

    Abstract: In one example, an optoelectronic assembly may include a laser array, an amplifier array, and a multimode interference coupler optically coupling the laser array and the amplifier array. The laser array may include at least one primary laser and at least one spare laser configured to be activated if the primary laser fails. The amplifier array may include at least two amplifiers configured to amplify optical signals received from the laser array.

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