- Patent Title: Package structure with interposer encapsulated by an encapsulant
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Application No.: US17555227Application Date: 2021-12-17
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Publication No.: US11887928B2Publication Date: 2024-01-30
- Inventor: Yung-Shun Chang , Sheng-Wen Yang , Teck-Chong Lee , Yen-Liang Huang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: FOLEY & LARDNER LLP
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L23/12 ; H01L23/31

Abstract:
A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.
Public/Granted literature
- US20230197600A1 PACKAGE STRUCTURE Public/Granted day:2023-06-22
Information query
IPC分类: