Invention Grant
- Patent Title: Package structure and fabrication methods
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Application No.: US18075141Application Date: 2022-12-05
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Publication No.: US11887934B2Publication Date: 2024-01-30
- Inventor: Han-Wen Chen , Steven Verhaverbeke , Giback Park , Giorgio Cellere , Diego Tonini , Vincent DiCaprio , Kyuil Cho
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Priority: IT 2019000006736 2019.05.10
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/538 ; H01L21/48 ; H01L23/13 ; H01L23/14 ; H01L23/498 ; H01L25/10 ; H01L23/66 ; H01Q1/22 ; H01Q1/24 ; H05K1/02 ; H01L21/50 ; H01L21/768 ; H01L25/065 ; H01L27/06 ; H01L21/60
Abstract:
The present disclosure relates to methods and apparatus for forming a thin-form-factor semiconductor package. In one embodiment, a glass or silicon substrate is structured by micro-blasting or laser ablation to form structures for formation of interconnections therethrough. The substrate is thereafter utilized as a frame for forming a semiconductor package with embedded dies therein.
Public/Granted literature
- US20230187370A1 PACKAGE STRUCTURE AND FABRICATION METHODS Public/Granted day:2023-06-15
Information query
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