Invention Publication
- Patent Title: PACKAGE STRUCTURE AND FABRICATION METHODS
-
Application No.: US18075141Application Date: 2022-12-05
-
Publication No.: US20230187370A1Publication Date: 2023-06-15
- Inventor: Han-Wen CHEN , Steven VERHAVERBEKE , Giback PARK , Giorgio CELLERE , Diego TONINI , Vincent DICAPRIO , Kyuil CHO
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Priority: IT 2019000006736 2019.05.10
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L21/48 ; H01L23/13 ; H01L23/14 ; H01L23/498 ; H01L25/10 ; H01L23/66 ; H01Q1/22 ; H01Q1/24 ; H05K1/02 ; H01L21/50 ; H01L21/768 ; H01L25/065 ; H01L27/06
Abstract:
The present disclosure relates to methods and apparatus for forming a thin-form-factor semiconductor package. In one embodiment, a glass or silicon substrate is structured by micro-blasting or laser ablation to form structures for formation of interconnections therethrough. The substrate is thereafter utilized as a frame for forming a semiconductor package with embedded dies therein.
Public/Granted literature
- US11887934B2 Package structure and fabrication methods Public/Granted day:2024-01-30
Information query
IPC分类:
