Invention Grant
- Patent Title: Microelectronic structures including bridges
-
Application No.: US16902927Application Date: 2020-06-16
-
Publication No.: US11887962B2Publication Date: 2024-01-30
- Inventor: Omkar G. Karhade , Nitin A. Deshpande , Mohit Bhatia , Sairam Agraharam , Edvin Cetegen , Anurag Tripathi , Malavarayan Sankarasubramanian , Jan Krajniak , Manish Dubey , Jinhe Liu , Wei Li , Jingyi Huang
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Akona IP PC
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/00 ; H01L23/498
Abstract:
Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.
Public/Granted literature
- US20210391295A1 MICROELECTRONIC STRUCTURES INCLUDING BRIDGES Public/Granted day:2021-12-16
Information query
IPC分类:
