公开(公告)号：US20210391295A1

公开(公告)日：2021-12-16

申请号：US16902927

申请日：2020-06-16

申请人： Intel Corporation

发明人： Omkar G. Karhade ,  Nitin A. Deshpande ,  Mohit Bhatia ,  Sairam Agraharam ,  Edvin Cetegen ,  Anurag Tripathi ,  Malavarayan Sankarasubramanian ,  Jan Krajniak ,  Manish Dubey ,  Jinhe Liu ,  Wei Li ,  Jingyi Huang

IPC分类号： H01L23/00 ,  H01L23/538 ,  H01L23/498

摘要： Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

公开(公告)号：US20210391273A1

公开(公告)日：2021-12-16

申请号：US16902777

申请日：2020-06-16

申请人： Intel Corporation

发明人： Manish Dubey ,  Omkar G. Karhade ,  Nitin A. Deshpande ,  Jinhe Liu ,  Sairam Agraharam ,  Mohit Bhatia ,  Edvin Cetegen

IPC分类号： H01L23/538 ,  H01L23/498 ,  H01L23/00

摘要： Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

公开(公告)号：US11791274B2

公开(公告)日：2023-10-17

申请号：US16902777

申请日：2020-06-16

申请人： Intel Corporation

发明人： Manish Dubey ,  Omkar G. Karhade ,  Nitin A. Deshpande ,  Jinhe Liu ,  Sairam Agraharam ,  Mohit Bhatia ,  Edvin Cetegen

IPC分类号： H01L21/768 ,  H01L23/522 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/528 ,  H01L23/532 ,  H01L23/538 ,  H01L23/498

CPC分类号： H01L23/5389 ,  H01L23/49827 ,  H01L24/17 ,  H01L2224/1703

摘要： Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

公开(公告)号：US11887962B2

公开(公告)日：2024-01-30

申请号：US16902927

申请日：2020-06-16

申请人： Intel Corporation

发明人： Omkar G. Karhade ,  Nitin A. Deshpande ,  Mohit Bhatia ,  Sairam Agraharam ,  Edvin Cetegen ,  Anurag Tripathi ,  Malavarayan Sankarasubramanian ,  Jan Krajniak ,  Manish Dubey ,  Jinhe Liu ,  Wei Li ,  Jingyi Huang

IPC分类号： H01L23/538 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L24/30 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/17 ,  H01L2224/1703

摘要： Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

公开(公告)号：US20230078395A1

公开(公告)日：2023-03-16

申请号：US17472048

申请日：2021-09-10

申请人： Intel Corporation

发明人： Robin Mcree ,  Yosuke Kanaoka ,  Gang Duan ,  Jinhe Liu ,  Timothy A. Gosselin

IPC分类号： H01L23/00 ,  H01L23/31

摘要： Disclosed herein are embedded heterogeneous architectures having minimized die shift and methods for manufacturing the same. The architectures may include a substrate, a bridge, and a material attached to the substrate. The substrate may include a first subset of vias and a second subset of vias. The bridge may be located in between the first subset and the second subset of vias. The material may include a first portion located proximate the first subset of vias, and a second portion located proximate the second subset of vias. The first and second portions may define a partial boundary of a cavity formed within the substrate and the bridge may be located within the cavity.