- Patent Title: Three-dimensional angle of arrival capability in electronic devices
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Application No.: US17644739Application Date: 2021-12-16
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Publication No.: US11892550B2Publication Date: 2024-02-06
- Inventor: Neha Dawar , Hoang Viet Nguyen , Khuong N. Nguyen , Songwei Li , Yuming Zhu , Boon Loong Ng , Yi Yang , Moonseok Kang , Jiho Shin , HyunChul Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Main IPC: G01S5/02
- IPC: G01S5/02 ; H04W16/28 ; G01S3/46 ; G01S3/04

Abstract:
A method includes obtaining signal information based on wireless signals received from an external electronic device via a first antenna pair and a second antenna pair. The first and second antenna pairs are aligned along different axes. The signal information includes channel information, range information, a first angle of arrival (AoA) based on the first antenna pair, and a second AoA based on the second antenna pair. The method also includes generating an initial prediction of a presence of the external electronic device relative to a field of view (FoV) of the electronic device. The method further includes performing a smoothing operation on the range information and the first and second AoA, the smoothing operation generating a predicted location of the external electronic device relative to the FoV of the electronic device. Additionally, the method includes generating, based on the smoothing operation, confidence values associated with the predicted location.
Public/Granted literature
- US20220196782A1 THREE-DIMENSIONAL ANGLE OF ARRIVAL CAPABILITY IN ELECTRONIC DEVICES Public/Granted day:2022-06-23
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