- Patent Title: Silicon photonic integrated lens compatible with wafer processing
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Application No.: US16562889Application Date: 2019-09-06
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Publication No.: US11894474B2Publication Date: 2024-02-06
- Inventor: Priyanka Dobriyal , Ankur Agrawal , Susheel Jadhav , Quan Tran , Raghuram Narayan , Raiyomand Aspandiar , Kenneth Brown , John Heck
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L31/02
- IPC: H01L31/02 ; H01L31/0232 ; G02B3/00 ; H01L31/0216 ; H01L25/16 ; H01L31/18 ; G02B1/11 ; G02B6/42 ; H01L23/538 ; G02B6/24
Abstract:
Embodiments disclosed herein include optoelectronic systems and methods of forming such systems. In an embodiment the optoelectronic system comprises a board, and a carrier attached to the board. In an embodiment, a first die is on the carrier. In an embodiment, the first die is a photonics die, and a surface of the first die is covered by an optically transparent layer.
Public/Granted literature
- US20210074866A1 SILICON PHOTONIC INTEGRATED LENS COMPATIBLE WITH WAFER PROCESSING Public/Granted day:2021-03-11
Information query
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