公开(公告)号：US11894474B2

公开(公告)日：2024-02-06

申请号：US16562889

申请日：2019-09-06

Applicant: Intel Corporation

Inventor： Priyanka Dobriyal ,  Ankur Agrawal ,  Susheel Jadhav ,  Quan Tran ,  Raghuram Narayan ,  Raiyomand Aspandiar ,  Kenneth Brown ,  John Heck

IPC: H01L31/02 ,  H01L31/0232 ,  G02B3/00 ,  H01L31/0216 ,  H01L25/16 ,  H01L31/18 ,  G02B1/11 ,  G02B6/42 ,  H01L23/538 ,  G02B6/24

CPC classification number: H01L31/02327 ,  G02B1/11 ,  G02B3/0012 ,  G02B3/0056 ,  G02B6/428 ,  H01L23/5385 ,  H01L25/167 ,  H01L31/02005 ,  H01L31/02019 ,  H01L31/02161 ,  H01L31/1876 ,  G02B6/241

Abstract: Embodiments disclosed herein include optoelectronic systems and methods of forming such systems. In an embodiment the optoelectronic system comprises a board, and a carrier attached to the board. In an embodiment, a first die is on the carrier. In an embodiment, the first die is a photonics die, and a surface of the first die is covered by an optically transparent layer.