Invention Grant
- Patent Title: Light emitting device, method of manufacturing covering member, and method of manufacturing light emitting device
-
Application No.: US17034899Application Date: 2020-09-28
-
Publication No.: US11894497B2Publication Date: 2024-02-06
- Inventor: Tadao Hayashi , Teruhito Azuma , Suguru Beppu , Kunihiro Izuno , Tsuyoshi Okahisa
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Foley & Lardner LLP
- Priority: JP 15109807 2015.05.29 JP 16031940 2016.02.23
- The original application number of the division: US16447935 2019.06.20
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/50 ; H01L33/48 ; H01L33/58 ; H01L33/60
Abstract:
A method of manufacturing a covering member includes: providing a first light-reflective member comprising a through-hole, the through-hole having first and second openings; arranging a light-transmissive resin containing a wavelength-conversion material within the through-hole; distributing the wavelength-conversion material predominantly on a side of the first opening of the through-hole within the light-transmissive resin; and after the step of distributing the wavelength-conversion material, removing a portion of the light-transmissive resin from a side of the second opening of the through-hole.
Public/Granted literature
Information query
IPC分类:
