- 专利标题： Chemical bonding method, package-type electronic component, and hybrid bonding method for electronic device
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申请号： US17962061申请日： 2022-10-07
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公开(公告)号： US11916038B2公开(公告)日： 2024-02-27
- 发明人: Takayuki Saitoh , Takayuki Moriwaki , Takehito Shimatsu , Miyuki Uomoto
- 申请人： CANON ANELVA CORPORATION , TOHOKU UNIVERSITY
- 申请人地址： JP Kawasaki
- 专利权人： CANON ANELVA CORPORATION,TOHOKU UNIVERSITY
- 当前专利权人： CANON ANELVA CORPORATION,TOHOKU UNIVERSITY
- 当前专利权人地址： JP Kawasaki; JP Sendai
- 代理机构： BUCHANAN, INGERSOLL & ROONEY PC
- 优先权： WO TJP2021004913 2021.02.10
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; C23C14/08 ; H01L21/50 ; H01L23/10 ; H01L23/20 ; C23C14/10 ; C23C14/16 ; C23C14/35 ; C23C14/58
摘要：
Substrates that are bonding targets are bonded in ambient atmosphere via bonding films, including oxides, formed on bonding faces of the substrates. The bonding films, which are metal or semiconductor thin films formed by vacuum film deposition and at least the surfaces of which are oxidized, are formed into the respective smooth faces of two substrates having the smooth faces that serve as the bonding faces. The bonding films are exposed to a space that contains moisture, and the two substrates are overlapped in the ambient atmosphere such that the surfaces of the bonding films are made to be hydrophilic and the surfaces of the bonding films contact one another. Through this, a chemical bond is generated at the bonded interface, and thereby the two substrates are bonded together in the ambient atmosphere. The bonding strength γ can be improved by heating the bonded substrates at a temperature.
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