Invention Grant
- Patent Title: Inspection system including reference specimen and method of forming semiconductor device
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Application No.: US17561276Application Date: 2021-12-23
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Publication No.: US11921270B2Publication Date: 2024-03-05
- Inventor: Sungil Choi , Yeeun Park , Kyungbeom Kim , Sungyoon Ryu , Jinwoo Ahn , Sunhong Jun
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR 20210090224 2021.07.09
- Main IPC: G02B21/02
- IPC: G02B21/02 ; G01J3/28 ; G02B21/00 ; G02B21/36

Abstract:
An inspection system includes a main support die configured to receive a target specimen; an auxiliary support die adjacent to the main support die and configured to receive a reference specimen; a cleaning device configured to remove contaminants from the reference specimen; an objective lens unit configured to direct light to main support die from a light source adjacent to the objective lens unit; a spectroscope between the objective lens unit and the light source; a detector adjacent to the objective lens unit; an imaging device between the objective lens unit and the detector; and a computer system in communication with the detector.
Public/Granted literature
- US20230008686A1 INSPECTION SYSTEM INCLUDING REFERENCE SPECIMEN AND METHOD OF FORMING SEMICONDUCTOR DEVICE Public/Granted day:2023-01-12
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