公开(公告)号：US11921270B2

公开(公告)日：2024-03-05

申请号：US17561276

申请日：2021-12-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungil Choi ,  Yeeun Park ,  Kyungbeom Kim ,  Sungyoon Ryu ,  Jinwoo Ahn ,  Sunhong Jun

IPC: G02B21/02 ,  G01J3/28 ,  G02B21/00 ,  G02B21/36

CPC classification number: G02B21/0004 ,  G01J3/2823 ,  G02B21/02 ,  G02B21/36

Abstract: An inspection system includes a main support die configured to receive a target specimen; an auxiliary support die adjacent to the main support die and configured to receive a reference specimen; a cleaning device configured to remove contaminants from the reference specimen; an objective lens unit configured to direct light to main support die from a light source adjacent to the objective lens unit; a spectroscope between the objective lens unit and the light source; a detector adjacent to the objective lens unit; an imaging device between the objective lens unit and the detector; and a computer system in communication with the detector.

公开(公告)号：US20240255439A1

公开(公告)日：2024-08-01

申请号：US18367784

申请日：2023-09-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heeyoon Han ,  Donghoon Kim ,  Sungyoon Ryu ,  Younghoon Sohn ,  Sunhong Jun

IPC: G01N21/95 ,  G01N21/31 ,  G06N20/00

CPC classification number: G01N21/9501 ,  G01N21/31 ,  G06N20/00

Abstract: A defect detection method includes radiating light onto a substrate, obtaining a spectrum image, performing an electrical die sorting (EDS) test on the substrate, inspecting defects of each of a plurality of blocks of the substrate based on a result of the EDS test, generating a defect map, generating spectrum image information by matching the spectrum image with the defect map, training a defect detection model by using the defect grade as an output value and the spectrum image information as an input value, obtaining a target spectrum image with respect to a target substrate, extracting a feature vector from the target spectrum image by using the defect detection model, and detecting a target defect grade of the target spectrum image based on the feature vector, and generating a target defect map based on the target defect grade.

公开(公告)号：US20230008686A1

公开(公告)日：2023-01-12

申请号：US17561276

申请日：2021-12-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungil Choi ,  Yeeun Park ,  Kyungbeom Kim ,  Sungyoon Ryu ,  Jinwoo Ahn ,  Sunhong Jun

IPC: G02B21/00 ,  G01J3/28 ,  G02B21/36 ,  G02B21/02

Abstract: An inspection system includes a main support die configured to receive a target specimen; an auxiliary support die adjacent to the main support die and configured to receive a reference specimen; a cleaning device configured to remove contaminants from the reference specimen; an objective lens unit configured to direct light to main support die from a light source adjacent to the objective lens unit; a spectroscope between the objective lens unit and the light source; a detector adjacent to the objective lens unit; an imaging device between the objective lens unit and the detector; and a computer system in communication with the detector.

公开(公告)号：US20250076116A1

公开(公告)日：2025-03-06

申请号：US18442539

申请日：2024-02-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunhong Jun ,  Sung Yoon Ryu ,  Younghoon Sohn ,  Eunsoo Hwang

IPC: G01J3/28 ,  G01J3/02

Abstract: An optical module includes: a diffraction grating configured to rotate and focus a beam, which is incident thereon from an incident path, onto a Fourier plane, a digital micromirror array (DMD) configured to assign a frequency for each wavelength of the focused beam received at the Fourier plane, and perform a Fourier transform for each frequency, and a first optical fiber configured to receive a beam that is reflected back from the DMD back and the diffraction grating, and along the incident path.

公开(公告)号：US20250003734A1

公开(公告)日：2025-01-02

申请号：US18639332

申请日：2024-04-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungyoon Ryu ,  Ingi Kim ,  Suhwan Park ,  Inkeun Baek ,  Younghoon Sohn ,  Soobin Sinn ,  Yusin Yang ,  Sunhong Jun ,  Ikseon Jeon

IPC: G01B11/06

Abstract: A measuring system measures an overall resistance of two or more films on a substrate/measurement object by a terahertz absorption measurement and an overall film thickness by a photoacoustic measurement. The system estimates a first film thickness based on the overall resistance, then subtracts this estimated thickness from the overall film thickness measured by the photoacoustic measurement. The system includes a source unit to output a laser beam. A first pump-probe unit receives the laser beam and performs a photoacoustic test on the measurement object. A second pump-probe unit receives the laser beam and performs a terahertz signal test on the measurement object. The system also includes a stage to support the measurement object and controls for controlling elements and calculating the film thicknesses

公开(公告)号：US20240295490A1

公开(公告)日：2024-09-05

申请号：US18237589

申请日：2023-08-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeho Kim ,  Younghoon Sohn ,  Sunhong Jun

IPC: G01N21/25 ,  G01N21/956

CPC classification number: G01N21/255 ,  G01N21/956 ,  G01N2201/06113 ,  G01N2201/0683

Abstract: A measurement apparatus includes a light source assembly configured to emit light to a sample, a measuring device configured to measure reflected light, and a stage on which the sample is provided, where the light source assembly includes a first plate, a plurality of light sources connected to the first plate and a blocking panel comprising a hole, and one of the plurality of light sources is aligned with the hole in a first direction.

公开(公告)号：US20240230528A1

公开(公告)日：2024-07-11

申请号：US18389028

申请日：2023-11-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sunhong Jun ,  Inkeun Baek ,  Wontae Kim ,  Namil Koo ,  Ingi Kim ,  Sungyoon Ryu ,  Younghoon Sohn ,  Yusin Yang ,  Ikseon Jeon ,  Eunhyuk Choi

IPC: G01N21/3581 ,  G01N21/95 ,  H01L21/66

CPC classification number: G01N21/3581 ,  G01N21/9501 ,  H01L22/12

Abstract: A measuring apparatus includes a stage including a transmissive wafer chuck on which a sample wafer is provided, where the sample wafer includes a silicon substrate and at least one material layer on the silicon substrate, a light source unit including a light source configured to generate and output a femtosecond laser beam, and a confocal laser-induced terahertz (THz) emission microscopy (LTEM) unit configured to generate multi-photon excitation by splitting the femtosecond laser beam into four sub-laser beams and causing three sub-laser beams among the four sub-laser beams to be incident in an overlapping manner on a measurement position of the sample wafer, where the confocal LTEM unit is configured to generate the multi-photon excitation based on the three sub-laser beams being incident on a lower surface of the silicon substrate.