- Patent Title: Development processing apparatus and development processing method
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Application No.: US17177270Application Date: 2021-02-17
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Publication No.: US11923218B2Publication Date: 2024-03-05
- Inventor: Kouichirou Tanaka , Masahiro Fukuda
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Venjuris, P.C.
- Priority: JP 20031413 2020.02.27
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/027 ; H01L21/673 ; H01L21/687

Abstract:
A development processing apparatus includes: a substrate holder that holds a substrate horizontally wherein the substrate includes a resist film; a rotator that rotates the substrate holder; first and second developer supplies that supply a developer to the substrate; and a liquid receiver that receives the developer from the substrate. The first developer supply is formed to have a length smaller than a diameter of the substrate. The second developer supply is formed to have a length equal to or larger than the diameter of the substrate. The liquid receiver includes first and second annular walls that are formed in an annular shape having a circular opening having a diameter larger than the diameter of the substrate. The first and second annular walls are movable up and down independently of each other, and a vertical distance between the first annular wall and the second annular wall is variable.
Public/Granted literature
- US20210272826A1 DEVELOPMENT PROCESSING APPARATUS AND DEVELOPMENT PROCESSING METHOD Public/Granted day:2021-09-02
Information query
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