Invention Grant
- Patent Title: Circuit board structure and manufacturing method thereof
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Application No.: US17448893Application Date: 2021-09-26
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Publication No.: US11991824B2Publication Date: 2024-05-21
- Inventor: Tzyy-Jang Tseng , Cheng-Ta Ko , Pu-Ju Lin , Chi-Hai Kuo , Shao-Chien Lee , Ming-Ru Chen , Cheng-Chung Lo
- Applicant: Unimicron Technology Corp.
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corp.
- Current Assignee: Unimicron Technology Corp.
- Current Assignee Address: TW Taoyuan
- Agency: CKC & Partners Co., LLC
- Priority: TW 0101060 2021.01.12 TW 0125380 2021.07.09
- Main IPC: H05K1/02
- IPC: H05K1/02 ; G02F1/1333 ; G02F1/1368 ; H05K1/03 ; H05K1/11 ; H05K3/00 ; H10K59/12 ; H10K59/123 ; H10K59/124 ; H10K59/131

Abstract:
A circuit board structure includes a first sub-circuit board, a second sub-circuit board, and a third sub-circuit board. The first sub-circuit board has an upper surface and a lower surface opposite to each other, and includes at least one first conductive through hole. The second sub-circuit board is disposed on the upper surface of the first sub-circuit board and includes at least one second conductive through hole. The third sub-circuit board is disposed on the lower surface of the first sub-circuit board and includes at least one third conductive through hole. At least two of the first conductive through hole, the second conductive through hole, and the third conductive through hole are alternately arranged in an axial direction perpendicular to an extending direction of the first sub-circuit board. The first, second and third sub-circuit boards are electrically connected to one another.
Public/Granted literature
- US20220071010A1 CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-03-03
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