Invention Grant
- Patent Title: Chemical mechanical polishing composition
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Application No.: US16765665Application Date: 2018-11-12
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Publication No.: US11993729B2Publication Date: 2024-05-28
- Inventor: Christian Daeschlein , Max Siebert , Yongqing Lan , Michael Lauter , Sheik Ansar Usman Ibrahim , Reza M Golzarian , Te Yu Wei , Haci Osman Guevenc , Julian Proelss , Leonardus Leunissen
- Applicant: BASF SE
- Applicant Address: DE Ludwigshafen am Rhein
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE
- Agency: Faegre Drinker Biddle & Reath LLP
- Priority: EP 203056 2017.11.22
- International Application: PCT/EP2018/080888 2018.11.12
- International Announcement: WO2019/101555A 2019.05.31
- Date entered country: 2020-05-20
- Main IPC: C09G1/02
- IPC: C09G1/02 ; H01L21/321

Abstract:
The presently claimed subject matter is directed to a chemical mechanical polishing (CMP) composition comprising inorganic particles, at least one organic compound comprising an amino group and/or at least one acid group (Y), potassium persulfate, at least one corrosion inhibitor and an aqueous medium for polishing substrates of the semiconductor industry comprising cobalt and/or a cobalt alloy and TiN and/or TaN.
Public/Granted literature
- US20200299547A1 CHEMICAL MECHANICAL POLISHING COMPOSITION Public/Granted day:2020-09-24
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