- 专利标题: Uplink segmentation offload to modem
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申请号: US17489753申请日: 2021-09-29
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公开(公告)号: US11997533B2公开(公告)日: 2024-05-28
- 发明人: Alok Mitra , Sitaramanjaneyulu Kanamarlapudi , Uppinder Babbar , Vaibhav Kumar , Haim Snapy , Vamsi Dokku , Dan Gilboa Waizman , Joseph Giacalone
- 申请人: QUALCOMM Incorporated
- 申请人地址: US CA San Diego
- 专利权人: QUALCOMM Incorporated
- 当前专利权人: QUALCOMM Incorporated
- 当前专利权人地址: US CA San Diego
- 代理机构: ArentFox Schiff LLP
- 代理商 Kevin M. Donnelly
- 主分类号: H04W28/06
- IPC分类号: H04W28/06 ; H04L47/36 ; H04L69/16 ; H04L69/166 ; H04L69/22 ; H04L69/24 ; H04W80/06
摘要:
This disclosure provides a method, apparatus, and computer-readable medium for wireless communication at a modem, comprising receiving, via an interface with a host, an internet protocol (IP) packet including a first transport protocol header and a first IP header. The IP packet has a size greater than a maximum transport unit (MTU) size allowable for each packet transmitted over a communication link. The modem segments the IP packet into a plurality of segments based on a segment size indicated by a segmentation policy. Each segment includes a respective derived segment transport protocol header and a respective derived segment IP header derived from the IP packet. Each of these derived headers includes at least one field based on the segmentation policy, and each of the segment transport protocol headers includes a checksum for the respective segment. Additionally, the modem transmits the plurality of segments over the communication link.
公开/授权文献
- US20230098349A1 UPLINK SEGMENTATION OFFLOAD TO MODEM 公开/授权日:2023-03-30
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