Invention Grant
- Patent Title: Curable composition of low density
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Application No.: US17274617Application Date: 2019-10-02
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Publication No.: US12006394B2Publication Date: 2024-06-11
- Inventor: Klaas Mennecke , Daniele Rutz , Sara Stauber-Fedier , Berzad Durmic
- Applicant: SIKA TECHNOLOGY AG
- Applicant Address: CH Baar
- Assignee: SIKA TECHNOLOGY AG
- Current Assignee: SIKA TECHNOLOGY AG
- Current Assignee Address: CH Baar
- Agency: Oliff PLC
- Priority: EP 198456 2018.10.03
- International Application: PCT/EP2019/076740 2019.10.02
- International Announcement: WO2020/070207A 2020.04.09
- Date entered country: 2021-03-09
- Main IPC: C08G18/30
- IPC: C08G18/30 ; C08G18/10 ; C08G18/24 ; C08G18/34 ; C08G18/38 ; C08G18/48 ; C08G18/75 ; C08K3/04 ; C08K3/22 ; C08K3/26 ; C08K3/36 ; C08K7/28

Abstract:
A moisture-curing composition including a) at least one moisture-reactive polymer P with a proportion of 10% to 60% by weight, based on overall composition, b) at least one inorganic filler F with a proportion of at least 9% by weight, based on overall composition, c) between 3% and 25% by weight, based on overall composition, of at least one type of microscopic hollow beads H, wherein composition has density of less than 1.20 kg/l, and microscopic hollow beads H have compressive strength, measured to ASTM D3102-72, of at least 2.5 MPa, and microscopic hollow beads H have a volume-based particle size D90, measured by Coulter counter, of less than 100 μm.
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