Invention Grant
- Patent Title: Fabricating wafers with electrical contacts on a surface parallel to an active surface
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Application No.: US17419385Application Date: 2020-09-16
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Publication No.: US12009352B2Publication Date: 2024-06-11
- Inventor: Arvin Emadi , Jon Aday , Ali Agah , Arnaud Rival
- Applicant: ILLUMINA, INC.
- Applicant Address: US CA San Diego
- Assignee: Illumina, Inc.
- Current Assignee: Illumina, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Heslin Rothenberg Farley and Mesiti, P.C.
- International Application: PCT/US2020/051117 2020.09.16
- International Announcement: WO2021/061474A 2021.04.01
- Date entered country: 2021-06-29
- Main IPC: H01L25/16
- IPC: H01L25/16 ; G01N21/64 ; H01L21/304 ; H01L21/56 ; H01L21/78 ; H01L23/00 ; H01L23/31
Abstract:
Provided herein include various examples of a method for manufacturing aspects of an apparatus, a sensor system. The method may include obtaining a first carrier bonded to an upper surface of the silicon wafer. This wafer includes through silicon vias (TSVs) extended through openings in a passivation stack, with electrical contacts coupled to portions of the TSVs exposed through these openings. The method may include de-bonding the first carrier from the upper surface of the silicon wafer. The method may include dicing the silicon wafer into subsections comprising dies.
Public/Granted literature
- US20220216191A1 FABRICATING WAFERS WITH ELECTRICAL CONTACTS ON A SURFACE PARALLEL TO AN ACTIVE SURFACE Public/Granted day:2022-07-07
Information query
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