Invention Grant
- Patent Title: Highly etch selective amorphous carbon film
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Application No.: US17963841Application Date: 2022-10-11
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Publication No.: US12014927B2Publication Date: 2024-06-18
- Inventor: Rajesh Prasad , Sarah Bobek , Prashant Kumar Kulshreshtha , Kwangduk Douglas Lee , Harry Whitesell , Hidetaka Oshio , Dong Hyung Lee , Deven Matthew Raj Mittal , Scott Falk , Venkataramana R. Chavva
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L21/033
- IPC: H01L21/033 ; C23C16/26 ; C23C16/505 ; C23C16/56 ; H01L21/02 ; H01L21/311 ; H01L21/3115

Abstract:
Methods and techniques for deposition of amorphous carbon films on a substrate are provided. In one example, the method includes depositing an amorphous carbon film on an underlayer positioned on a susceptor in a first processing region. The method further includes implanting a dopant or the inert species into the amorphous carbon film in a second processing region. The implant species, energy, dose & temperature in some combination may be used to enhance the hardmask hardness. The method further includes patterning the doped amorphous carbon film. The method further includes etching the underlayer.
Public/Granted literature
- US20230041963A1 HIGHLY ETCH SELECTIVE AMORPHOUS CARBON FILM Public/Granted day:2023-02-09
Information query
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