Invention Grant
- Patent Title: Apparatus and method for processing substrate
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Application No.: US17955206Application Date: 2022-09-28
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Publication No.: US12014938B2Publication Date: 2024-06-18
- Inventor: Yong Hee Lee , Young Hun Lee , Jinwoo Jung , Eui Sang Lim
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Chungcheongnam-do
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Chungcheongnam-Do
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: KR 20170162567 2017.11.30 KR 20180031000 2018.03.16
- The original application number of the division: US17026389 2020.09.21
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/02 ; H01L21/687

Abstract:
Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber.
Public/Granted literature
- US20230018637A1 APPARATUS AND METHOD FOR PROCESSING SUBSTRATE Public/Granted day:2023-01-19
Information query
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