Invention Grant
- Patent Title: Device and method of very high density routing used with embedded multi-die interconnect bridge
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Application No.: US18091048Application Date: 2022-12-29
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Publication No.: US12014989B2Publication Date: 2024-06-18
- Inventor: Robert Alan May , Wei-Lun Kane Jen , Jonathan L. Rosch , Islam A. Salama , Kristof Darmawikarta
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L21/48 ; H01L21/683 ; H01L23/00 ; H01L25/00 ; H01L25/065

Abstract:
A device and method for providing enhanced bridge structures is disclosed. A set of conducting and insulating layers are deposited and lithographically processed. The conducting layers have uFLS routing. A bridge with uFLS contacts and die disposed on the underlying structure such that the die are connected with the uFLS contacts and uFLS routing. For core-based structures, the layers are formed after the bridge is placed on the underlying structure and the die connected to the bridge through intervening conductive layers. For coreless structures, the layers are formed over the bridge and carrier, which is removed prior to bonding the die to the bridge, and the die bonded directly to the bridge.
Public/Granted literature
- US20230135165A1 DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED MULTI-DIE INTERCONNECT BRIDGE Public/Granted day:2023-05-04
Information query
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