Invention Grant
- Patent Title: Gate structure and method of forming the same
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Application No.: US17814175Application Date: 2022-07-21
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Publication No.: US12015070B2Publication Date: 2024-06-18
- Inventor: Yi-Chun Chen , Tsung Fan Yin , Li-Te Hsu , Ying Ting Hsia , Yi-Wei Chiu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- The original application number of the division: US16390190 2019.04.22
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/28 ; H01L29/49 ; H01L29/66 ; H01L29/78

Abstract:
A method of forming a gate structure includes forming an opening through an insulating layer and forming a first work function metal layer in the opening. The method also includes recessing the first work function metal layer into the opening to form a recessed first work function metal layer, and forming a second work function metal layer in the opening and over the first work function metal layer. The second work function metal layer lines and overhangs the recessed first work function metal layer.
Public/Granted literature
- US20220367664A1 Gate Structure and Method of Forming the Same Public/Granted day:2022-11-17
Information query
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