Invention Grant
- Patent Title: Semiconductor device fabricated using channeling implant
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Application No.: US17476829Application Date: 2021-09-16
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Publication No.: US12057316B2Publication Date: 2024-08-06
- Inventor: Moriz Jelinek , Paul Ellinghaus , Axel Koenig , Caspar Leendertz , Hans-Joachim Schulze , Werner Schustereder
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Cooper Legal Group LLC
- Main IPC: H01L21/265
- IPC: H01L21/265 ; H01L21/04 ; H01L29/04 ; H01L29/16 ; H01L29/167

Abstract:
A method includes orienting a silicon carbide layer to a first crystal channel direction relative to a first ion beam and implanting phosphorous into the silicon carbide layer using the first ion beam to define a first doped region in the silicon carbide layer. A deviation angle between the first crystal channel direction and the first ion beam is less than ±1° and the first crystal channel direction comprises a direction or a direction.
Public/Granted literature
- US20230083106A1 SEMICONDUCTOR DEVICE Public/Granted day:2023-03-16
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