An electronic device includes a chip component including a terminal electrode, a case having an accommodation recess accommodating the chip component, a conductive terminal attached to the case and connected to the terminal electrode, and a case cover disposed on an opening-edge surface of the case so as to cover the accommodation recess. The opening-edge surface has an opening-edge recess at least partly covered by the case cover. The opening-edge recess and the case cover have a space therebetween. The space is filled with a resin.