公开(公告)号：US12278055B2

公开(公告)日：2025-04-15

申请号：US18154165

申请日：2023-01-13

Applicant: TDK CORPORATION

Inventor： Akihiro Masuda ,  Shinya Ito ,  Norihisa Ando ,  Hideki Kaneko ,  Ken Aburakawa ,  Kenya Tamaki ,  Akitoshi Yoshii

IPC: H01G4/224 ,  H01G4/005 ,  H01G4/12 ,  H01G4/248

Abstract: An electronic component having a case including an accommodation part having an opening; a ceramic element in the accommodation part with first and second main faces facing each other, a first and second electrode formed to the first and second main face, respectively; a first metal terminal including a first electrode connecting part connecting to the first electrode, a first mounting part exposed out of the accommodation part through the opening, and a first terminal arm part connecting the first electrode connecting part and the first mounting part; a second metal terminal including a second electrode connecting part connecting to the second electrode, a second mounting part exposed out of the accommodation part through the opening, and a second terminal arm part connecting the second electrode connecting part and the second mounting part; and an insulation member between the first electrode and the second terminal arm part.

公开(公告)号：US20240320579A1

公开(公告)日：2024-09-26

申请号：US18604767

申请日：2024-03-14

Applicant: TDK Corporation

Inventor： Akihiro Masuda ,  Airi Yokoyama ,  Takaaki Sato

IPC: G06Q10/0631

CPC classification number: G06Q10/06313

Abstract: A production planning device includes an acquisition unit and a distribution planning unit. The acquisition unit acquires article list information. The article list information includes information regarding a plurality of types of articles. The distribution planning unit creates distribution plan data. The distribution plan data is data for distributing a plurality of types of articles included in the article list information to a plurality of production lines. The distribution planning unit creates distribution plan data based on entropy associated with loss information regarding loss of production process speed in each production line.

公开(公告)号：US11335508B2

公开(公告)日：2022-05-17

申请号：US16725374

申请日：2019-12-23

Applicant: TDK CORPORATION

Inventor： Norihisa Ando ,  Shinya Ito ,  Kosuke Yazawa ,  Akihiro Masuda ,  Yoshiki Satou ,  Katsumi Kobayashi

IPC: H01G4/30 ,  H01G4/005 ,  H01G4/224 ,  H01G4/248 ,  H01G4/38

Abstract: An electronic device including chip components each having a first terminal electrode and a second terminal electrode formed on both end faces, and a case provided with an accommodation recess in which the chip components are accommodated, and an opening edge face formed around an opening face of the accommodation recess. An individual metal terminal is attached to the case. The individual metal terminal includes an inner electrode part inserted along an inner side wall of the accommodation recess in the case for connecting to the first terminal electrode, an opening edge electrode part formed over the opening edge face to be continuous to the inner electrode part and a side electrode part formed along the outer side face of the case to be continuous to the opening edge electrode part.

公开(公告)号：US11984260B2

公开(公告)日：2024-05-14

申请号：US17133102

申请日：2020-12-23

Applicant: TDK CORPORATION

Inventor： Akihiro Masuda ,  Shinya Ito ,  Norihisa Ando ,  Kosuke Yazawa ,  Yoshiki Satou ,  Katsumi Kobayashi ,  Koji Utsui ,  Koji Kaneko

IPC: H01G4/224 ,  H01G2/06 ,  H01G4/228

CPC classification number: H01G2/065 ,  H01G4/224 ,  H01G4/228

Abstract: An electronic device includes a chip component, a conductive terminal, a case, and a fixation part. The chip component includes a terminal electrode on an end surface of the chip component. The conductive terminal is connected to the terminal electrode. The case includes an accommodation recess for accommodating the chip component. The fixation part fixes the case to an installation portion.

公开(公告)号：US11594379B2

公开(公告)日：2023-02-28

申请号：US17494538

申请日：2021-10-05

Applicant: TDK CORPORATION

Inventor： Akihiro Masuda ,  Shinya Ito ,  Norihisa Ando ,  Tomoyuki Sasaki ,  Shinya Onodera

IPC: H01G4/38 ,  H01G4/224 ,  H01G4/30 ,  H01G2/08 ,  H01G2/06 ,  H01G4/12

Abstract: An electronic device includes a plurality of chip components and an insulating case. The chip components are arranged in a first direction. The case includes a plate portion, a first protrusion portion, and a second protrusion portion. The plate portion faces first side surfaces of the chip components. The first protrusion portion is formed along a plate-portion first side of the plate portion and protrudes from the plate portion toward a downside perpendicular to the first direction. The second protrusion portion is formed to the first protrusion portion in a second direction and protrudes from the plate portion toward the downside. A protrusion length of the first protrusion portion and the second protrusion portion from the plate portion toward the downside is smaller than a protrusion length of the chip component included in the chip components from the plate portion toward the downside.

公开(公告)号：US11495405B2

公开(公告)日：2022-11-08

申请号：US16816856

申请日：2020-03-12

Applicant: TDK Corporation

Inventor： Akihiro Masuda ,  Norihisa Ando ,  Shinya Ito ,  Kosuke Yazawa ,  Yoshiki Satou ,  Katsumi Kobayashi

IPC: H01G2/06 ,  H01G4/005 ,  H01G4/12 ,  H01G4/228 ,  H01G4/30

Abstract: An electronic component has capacitor chips where terminal electrodes are formed on both end surfaces, individual metal terminals connected to the terminal electrodes, an insulation case accommodating the capacitor chips, and a connecting portion interconnecting a plurality of the insulation cases.

公开(公告)号：US11222752B2

公开(公告)日：2022-01-11

申请号：US17063106

申请日：2020-10-05

Applicant: TDK CORPORATION

Inventor： Akihiro Masuda ,  Norihisa Ando ,  Shinya Ito

IPC: H01G4/248 ,  H01G4/232

Abstract: A ceramic electronic device includes a ceramic element body, a terminal electrode, and a lead terminal. The ceramic element body has an end surface and a lateral surface. The terminal electrode is formed on from the end surface to a part of the lateral surface of the ceramic element body. The lead terminal is connected to the terminal electrode by a connection member. The lead terminal includes an electrode facing portion disposed correspondingly to an end-surface electrode of the terminal electrode, an extension portion extending downward from a lower end of the electrode facing portion, and a step surface located between the electrode facing portion and the extension portion. The electrode facing portion has a first recess facing the terminal electrode. A part of the first recess reaches the step surface. Another part of the first recess is open outside the lead terminal.

公开(公告)号：US12062495B2

公开(公告)日：2024-08-13

申请号：US18331358

申请日：2023-06-08

Applicant: TDK CORPORATION

Inventor： Akihiro Masuda ,  Takaaki Sato ,  Norihisa Ando ,  Shinya Ito ,  Kosuke Yazawa

IPC: H01G4/38 ,  H01G4/224 ,  H01G4/236

CPC classification number: H01G4/224 ,  H01G4/236 ,  H01G4/38

Abstract: An electronic device includes a chip component including a terminal electrode, a case having an accommodation recess accommodating the chip component, a conductive terminal attached to the case and connected to the terminal electrode, and a case cover disposed on an opening-edge surface of the case so as to cover the accommodation recess. The opening-edge surface has an opening-edge recess at least partly covered by the case cover. The opening-edge recess and the case cover have a space therebetween. The space is filled with a resin.

公开(公告)号：US11961676B2

公开(公告)日：2024-04-16

申请号：US17847717

申请日：2022-06-23

Applicant: TDK CORPORATION

Inventor： Akihiro Masuda ,  Shinya Ito ,  Norihisa Ando ,  Kosuke Yazawa ,  Yoshiki Satou ,  Katsumi Kobayashi

IPC: H01G4/224 ,  H01G4/30

CPC classification number: H01G4/224 ,  H01G4/30

Abstract: An electronic device 10 comprises chip capacitors 20a and 20b, an accommodation recess 62 accommodating the chip capacitors 20a and 20b, and a case 60 including a protrusion 64 partitioning the accommodation recess 62 into a first accommodation space 62a and a second accommodation space 62b along the X-axis direction. The protrusion 64 includes a first protrusion 64a and a second protrusion 64b disposed away from the first protrusion 64a along the Y-axis direction. The first protrusion 64a and the second protrusion 64b are disposed with a communication space 69 provided between the first protrusion 64a and the second protrusion 64b, so that the first accommodation space 62a and the second accommodation space 62b communicate.

公开(公告)号：US11810723B2

公开(公告)日：2023-11-07

申请号：US17495274

申请日：2021-10-06

Applicant: TDK CORPORATION ,  TDK XIAMEN CO., LTD.

Inventor： Masahiro Mori ,  Akihiro Masuda ,  Shinya Ito ,  Norihisa Ando

IPC: H01G4/232 ,  H01G4/008 ,  H01G4/012 ,  H01G4/30

CPC classification number: H01G4/2325 ,  H01G4/008 ,  H01G4/012 ,  H01G4/30

Abstract: A ceramic electronic component including: a ceramic element body including an end surface extending along a first axis, and a side surface extending along a second axis and intersecting the end surface; an end-face electrode formed on the end surface of the ceramic element body; and a lead terminal connected to the end-face electrode by soldering. The lead terminal includes: an adjacent part overlapping the end-face electrode in a side view from the second axis; and an extension part extending from an end of the adjacent part in a direction away from a plane including the side surface. A first recess is formed at the extension part and is recessed in a direction away from a plane including the end surface, and the first recess exists at a position close to the end of the adjacent part.