Electronic component
    1.
    发明授权

    公开(公告)号:US12278055B2

    公开(公告)日:2025-04-15

    申请号:US18154165

    申请日:2023-01-13

    Abstract: An electronic component having a case including an accommodation part having an opening; a ceramic element in the accommodation part with first and second main faces facing each other, a first and second electrode formed to the first and second main face, respectively; a first metal terminal including a first electrode connecting part connecting to the first electrode, a first mounting part exposed out of the accommodation part through the opening, and a first terminal arm part connecting the first electrode connecting part and the first mounting part; a second metal terminal including a second electrode connecting part connecting to the second electrode, a second mounting part exposed out of the accommodation part through the opening, and a second terminal arm part connecting the second electrode connecting part and the second mounting part; and an insulation member between the first electrode and the second terminal arm part.

    Electronic device
    2.
    发明授权

    公开(公告)号:US11335508B2

    公开(公告)日:2022-05-17

    申请号:US16725374

    申请日:2019-12-23

    Abstract: An electronic device including chip components each having a first terminal electrode and a second terminal electrode formed on both end faces, and a case provided with an accommodation recess in which the chip components are accommodated, and an opening edge face formed around an opening face of the accommodation recess. An individual metal terminal is attached to the case. The individual metal terminal includes an inner electrode part inserted along an inner side wall of the accommodation recess in the case for connecting to the first terminal electrode, an opening edge electrode part formed over the opening edge face to be continuous to the inner electrode part and a side electrode part formed along the outer side face of the case to be continuous to the opening edge electrode part.

    Electronic device
    4.
    发明授权

    公开(公告)号:US12062495B2

    公开(公告)日:2024-08-13

    申请号:US18331358

    申请日:2023-06-08

    CPC classification number: H01G4/224 H01G4/236 H01G4/38

    Abstract: An electronic device includes a chip component including a terminal electrode, a case having an accommodation recess accommodating the chip component, a conductive terminal attached to the case and connected to the terminal electrode, and a case cover disposed on an opening-edge surface of the case so as to cover the accommodation recess. The opening-edge surface has an opening-edge recess at least partly covered by the case cover. The opening-edge recess and the case cover have a space therebetween. The space is filled with a resin.

    Electronic device
    5.
    发明授权

    公开(公告)号:US11961676B2

    公开(公告)日:2024-04-16

    申请号:US17847717

    申请日:2022-06-23

    CPC classification number: H01G4/224 H01G4/30

    Abstract: An electronic device 10 comprises chip capacitors 20a and 20b, an accommodation recess 62 accommodating the chip capacitors 20a and 20b, and a case 60 including a protrusion 64 partitioning the accommodation recess 62 into a first accommodation space 62a and a second accommodation space 62b along the X-axis direction. The protrusion 64 includes a first protrusion 64a and a second protrusion 64b disposed away from the first protrusion 64a along the Y-axis direction. The first protrusion 64a and the second protrusion 64b are disposed with a communication space 69 provided between the first protrusion 64a and the second protrusion 64b, so that the first accommodation space 62a and the second accommodation space 62b communicate.

    Ceramic electronic component
    6.
    发明授权

    公开(公告)号:US11810723B2

    公开(公告)日:2023-11-07

    申请号:US17495274

    申请日:2021-10-06

    CPC classification number: H01G4/2325 H01G4/008 H01G4/012 H01G4/30

    Abstract: A ceramic electronic component including: a ceramic element body including an end surface extending along a first axis, and a side surface extending along a second axis and intersecting the end surface; an end-face electrode formed on the end surface of the ceramic element body; and a lead terminal connected to the end-face electrode by soldering. The lead terminal includes: an adjacent part overlapping the end-face electrode in a side view from the second axis; and an extension part extending from an end of the adjacent part in a direction away from a plane including the side surface. A first recess is formed at the extension part and is recessed in a direction away from a plane including the end surface, and the first recess exists at a position close to the end of the adjacent part.

    Electronic device
    7.
    发明授权

    公开(公告)号:US11646163B2

    公开(公告)日:2023-05-09

    申请号:US17228822

    申请日:2021-04-13

    CPC classification number: H01G4/40 H01F27/28 H01G4/224 H01G4/228 H01G4/38

    Abstract: An electronic device includes first and second capacitors, a case, a coil, and first to fourth conductive terminals. The first capacitor includes first and second terminal electrodes. The second capacitor includes third and fourth terminal electrodes. The case includes an accommodation recess for accommodating the first and second capacitors. The coil is separated from the first and second capacitors by a part of the case and disposed outside the accommodation recess. The first terminal is connected to the first electrode and partly disposed on a mounting-side bottom surface of the case. The second terminal is connected to one end of the coil and the second electrode and partly disposed on the surface. The third terminal is connected to the other end of the coil and the third electrode and partly disposed on the surface. The fourth terminal is connected to the fourth electrode and partly disposed on the surface.

    Ceramic electronic device
    8.
    发明授权

    公开(公告)号:US11615920B2

    公开(公告)日:2023-03-28

    申请号:US17062736

    申请日:2020-10-05

    Abstract: A ceramic electronic device includes a ceramic element body, a terminal electrode, and a lead terminal. The ceramic element body has an end surface and a lateral surface. The terminal electrode is formed on from the end surface to a part of the lateral surface of the ceramic element body. The lead terminal is connected to the terminal electrode by a connection member. The lead terminal includes an electrode facing portion disposed correspondingly to an end-surface electrode of the terminal electrode, an extension unit extending downward from a lower end of the electrode facing portion, and a step surface located between the electrode facing portion and the extension unit. The electrode facing portion has a recess dented in a direction away from the terminal electrode. A center of the recess is located below a center of the electrode facing portion in a height direction.

    Conductive terminal and electronic device

    公开(公告)号:US11367572B2

    公开(公告)日:2022-06-21

    申请号:US16988819

    申请日:2020-08-10

    Abstract: A conductive terminal includes an inner electrode part, an opening edge electrode part, and a lateral electrode part. The inner electrode part is connectable to a terminal electrode of a chip component by being inserted along an inner wall of an accommodation recess of a case. The opening edge electrode part is formed continuously to the inner electrode part. The lateral electrode part is formed continuously to the opening edge electrode part along an outer surface of the case. The inner electrode part includes a base part, a curved part, and a continuous boundary part. The base part continues to the opening edge electrode part. The curved part is formed near a tip of the base part and protrudes away from the lateral electrode part. The continuous boundary part is formed between the base part and the curved part and continuously connects them.

    Ceramic electronic component with lead terminals having a coating layer

    公开(公告)号:US11158460B2

    公开(公告)日:2021-10-26

    申请号:US17006100

    申请日:2020-08-28

    Abstract: A ceramic electronic component of the present invention includes: a ceramic element body; a terminal electrode formed on from an end surface to a side surface of the ceramic element body; and a lead terminal joined to the terminal electrode by a solder. A fillet of the solder is formed between the terminal electrode of a side surface at the ceramic element body and the lead terminal, and a coating layer is formed on a surface of the lead terminal that is in contact with the solder. The coating layer is formed of a metal component having a contact angle with the solder smaller than that of the lead terminal.

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