- 专利标题: Line-end extension method and device
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申请号: US17869707申请日: 2022-07-20
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公开(公告)号: US12062543B2公开(公告)日: 2024-08-13
- 发明人: Chih-Min Hsiao , Chien-Wen Lai , Ru-Gun Liu , Chih-Ming Lai , Shih-Ming Chang , Yung-Sung Yen , Yu-Chen Chang
- 申请人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Seed IP Law Group LLP
- 分案原申请号: US16806206 2020.03.02
- 主分类号: H01L21/033
- IPC分类号: H01L21/033 ; H01L21/265 ; H01L21/311 ; H01L21/3115
摘要:
Methods of forming line-end extensions and devices having line-end extensions are provided. In some embodiments, a method includes forming a patterned photoresist on a first region of a hard mask layer. A line-end extension region is formed in the hard mask layer. The line-end extension region extends laterally outward from an end of the first region of the hard mask layer. The line-end extension region may be formed by changing a physical property of the hard mask layer at the line-end extension region.
公开/授权文献
- US20220359203A1 LINE-END EXTENSION METHOD AND DEVICE 公开/授权日:2022-11-10
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