Invention Grant
- Patent Title: Polishing composition, production method of the same, polishing method and a manufacturing method of a semiconductor substrate
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Application No.: US17197246Application Date: 2021-03-10
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Publication No.: US12077680B2Publication Date: 2024-09-03
- Inventor: Akiko Soumiya
- Applicant: FUJIMI INCORPORATED
- Applicant Address: JP Aichi
- Assignee: FUJIMI INCORPORATED
- Current Assignee: FUJIMI INCORPORATED
- Current Assignee Address: JP Aichi
- Agency: Katten Muchin Rosenman LLP
- Priority: JP 20053111 2020.03.24
- Main IPC: C09G1/02
- IPC: C09G1/02 ; H01L21/321

Abstract:
The present invention is to provide means for polishing an object to be polished containing titanium nitride at a high polishing speed. The present invention relates to a polishing composition containing silica particles and a polishing accelerator, wherein the polishing accelerator is a compound having an aromatic heterocyclic ring and an OH group or a group of a salt thereof directly bonded to the aromatic heterocyclic ring, or a compound having an aromatic hydrocarbon ring, an OH group or a group of a salt thereof directly bonded to the aromatic hydrocarbon ring, and a COOH group or a group of a salt thereof directly bonded to the aromatic hydrocarbon ring, and the polishing composition is used for polishing an object to be polished containing titanium nitride.
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