- 专利标题: Fabrication of thin film fin transistor structure
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申请号: US17129867申请日: 2020-12-21
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公开(公告)号: US12080781B2公开(公告)日: 2024-09-03
- 发明人: Noriyuki Sato , Sarah Atanasov , Abhishek A. Sharma , Bernhard Sell , Chieh-Jen Ku , Elliot N. Tan , Hui Jae Yoo , Travis W. Lajoie , Van H. Le , Pei-Hua Wang , Jason Peck , Tobias Brown-Heft
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwabe, Williamson & Wyatt, P.C.
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L21/8234 ; H01L27/092
摘要:
Thin film transistors fabricated using a spacer as a fin are described. In an example, a method of forming a fin transistor structure includes patterning a plurality of backbone pillars on a semiconductor substrate. The method may then include conformally depositing a spacer layer over the plurality of backbone pillars and the semiconductor substrate. A spacer etch of the spacer layer is then performed to leave a sidewall of the spacer layer on a backbone pillar to form a fin of the fin transistor structure. Other embodiments may be described and claimed.
公开/授权文献
- US20220199807A1 FABRICATION OF THIN FILM FIN TRANSISTOR STRUCTURE 公开/授权日:2022-06-23
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